Datasheet > AT68166F-YM15-ESCC

AT68166F-YM15-ESCC

更新时间： 2024-01-24 20:32:24

品牌	Logo	应用领域
爱特美尔 - ATMEL		静态存储器
页数	文件大小	规格书
15页	339K
描述
Standard SRAM, 512KX32, 15ns, CMOS, CQFP68, 0.950 INCH, CERAMIC, QFP-68

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数据手册

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Features

• Can be used as either 1 off 512k x 32, 2 off 512k x 16 or 4 off 512k x 8

• Operating Voltage: 3.3V

• Access Time:

– 15 ns for 3.3V biased only (AT68166F)

– 25 ns & 17 ns for 5V Tolerant (AT68166FT)

• Very Low Power Consumption

– Active: 650 mW per byte (Max) @ 15 ns - 540 mW per byte (Max) @ 25ns

– Standby: 15 mW (Typ)

• Wide Temperature Range: -55 to +125°C

• TTL-Compatible Inputs and Outputs

Rad Hard

• Asynchronous

• Die manufactured on Atmel 0.25 µm Radiation Hardened Process

• No Single Event Latch Up below LET Threshold of 80 MeV/mg/cm²

• Tested up to a Total Dose of 300 krads (Si) according to MIL-STD-883 Method 1019

• 950 Mils Wide MQFPT 68 Package

16 MegaBit

SRAM Multi

Chip Module

• ESD Better than 4000V for the AT68166F

• ESD Better than 2000V for the AT68166FT

• Quality Grades: ESCC, QML-Q or V

Description

AT68166F

AT68166FT

The AT68166F/FT is a Radiation Hardened hermetic Multi Chip Modules (MCM), inte-

grating very low-power CMOS asynchronous static RAM which can be organized as 1

bank off 512K x 32, 2 banks off 512Kx16, or 4 banks off 512Kx8. It is built with 4 dies

of the AT60142F/FT SRAM keeping all their basic characteristics: power consump-

tion, stand by current, data retention, Multiple Bit Upset (MBU) immune, etc…

This MCM takes full benefit of Atmel expertise in hermetic ceramic package assembly.

The small size of the AT60142F/FT die allows for assembling it in a 68 pins quad flat

pack which results into a package footprint compatible with products from other

sources. Furthermore, all die being assembled on the same package side makes

power dissipation through the PCB much easier and more efficient.

Advanced

Information

This MCM brings the solution to applications where fast computing is as mandatory as

low power consumption and higher integration density, saving 75% of the PCB area

used when using the individually package 4MB SRAM.

The F version is biased at 3.3V and is not 5V tolerant. It is available in 15 ns

specification.

The FT version is a variant allowing for 5V tolerance. It is available in 25 ns and 17 ns

specification.

The AT68166F/FT will be processed according to the test methods of the latest revi-

sion of the MIL PRF-38535 or the ESCC 9000.

7531B–AERO–02/06

12 3 4 5 6 7...15

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与AT68166F-YM15-ESCC相关器件

型号	品牌	获取价格	描述	数据表
AT68166F-YM15-MQ	ATMEL	获取价格	Standard SRAM, 512KX32, 15ns, CMOS, CQFP68, 0.950 INCH, CERAMIC, QFP-68
AT68166F-YM15-SV	ATMEL	获取价格	Standard SRAM, 512KX32, 15ns, CMOS, CQFP68, 0.950 INCH, CERAMIC, QFP-68
AT68166F-YM20-E	ATMEL	获取价格	Rad Hard 16 MegaBit 3.3V SRAM MultiChip Module
AT68166F-YM20ESCC	ATMEL	获取价格	Standard SRAM, 512KX32, 20ns, CMOS, CQFP68, 0.950 INCH, CERAMIC, MQFP-68
AT68166F-YM20-SCC	ATMEL	获取价格	Rad Hard 16 MegaBit 3.3V SRAM MultiChip Module
AT68166F-YS18-E	ATMEL	获取价格	Rad Hard 16 MegaBit 3.3V SRAM MultiChip Module
AT68166F-YS18-MQ	ATMEL	获取价格	Rad Hard 16 MegaBit 3.3V SRAM MultiChip Module
AT68166F-YS18-SCC	ATMEL	获取价格	Rad Hard 16 MegaBit 3.3V SRAM MultiChip Module
AT68166F-YS18-SR	ATMEL	获取价格	Rad Hard 16 MegaBit 3.3V SRAM MultiChip Module
AT68166F-YS18-SV	ATMEL	获取价格	Rad Hard 16 MegaBit 3.3V SRAM MultiChip Module

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