Datasheet > ARRAYJ-30035-64P-PCB

ARRAYJ-30035-64P-PCB

更新时间： 2024-09-16 11:01:43

品牌	Logo	应用领域
安森美 - ONSEMI		光电
页数	文件大小	规格书
32页	5764K
描述
硅光电倍增阵列，J 系列 (SiPM)

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ArrayJ Series

Silicon Photomultiplier

(SiPM) High Fill-Factor

Arrays

ON Semiconductor’s range of J−Series SiPM sensors have been

used to create high fill−factor, scaleable arrays. The sensors are

mounted onto PCB boards with minimal dead space, forming arrays

with industry−leading fill factor of up to 90%.

www.onsemi.com

The back of each ArrayJ has either one or more multi−way

connectors, or a BGA (ball grid array). These allow access to the fast

output* and standard I/O from each pixel in the array, and a common

I/O from the summed substrates of the pixels.

The ArrayJ products with connectors can be used to interface with

the user’s own readout via a mating connector, or to a

ON Semiconductor Breakout Board (BOB). The BOBs allow for easy

access to the pixel signals and performance evaluation of the arrays.

ArrayJ products with the BGA can be reflow soldered to the user’s

readout boards, or purchased ready−mounted on a pinned PCB

evaluation board for easy testing. A BGA ArrayJ cannot be removed

from it’s PCB evaluation board. This contrasts with an ArrayJ with

connectors, as multiple arrays can be evaluated with a single BOB.

Common

ArrayJ Inputs and Outputs (I/O)

Figure 1 summarizes the array schematic for a portion of an ArrayJ.

Each SiPM sensor in the array has three electrical connections: fast

output, standard output and common.

Sn+1

Fn+1

Sn+2

Fn+2

The substrates (cathodes) of all sensors are summed together to

form the common I/O.

Each individual fast output and standard I/O (anode) are routed to its

own output pin.

The pixel−level performance of the sensors in the array can be found

in the J−Series datasheet.

Figure 1. Signal connections at the pixel

level on the ArrayJ products.

Table of Contents

ARRAYJ-60035-64P-PCB (8 X 8 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 2

ARRAYX-BOB6-64P (Breakout Board for the ARRAYJ-60035-64P) . . . . . . . . . 5

ARRAYX-BOB6-64S (Summed Breakout Board for the ARRAYJ-60035-64P) . . . 7

ARRAYJ-60035-4P-BGA (2 X 2 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 9

ARRAYJ-60035-4P-PCB (2 X 2 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 12

ARRAYJ-300XX-16P-PCB (4 X 4 Array of 3 mm Pixels) . . . . . . . . . . . . . . . . . . 17

ARRAYJ-BOB3-16P (ARRAYJ-300XX-16P Breakout Board) . . . . . . . . . . . . . . 19

ARRAYJ-300XX-64P-PCB (8 X 8 Array of 3 mm Pixels) . . . . . . . . . . . . . . . . . . 21

ARRAYJ-BOB3-64P (ARRAYJ-300XX-64P & ARRAYJ-40035-64P

Breakout Board) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Biasing and Readout from the Standard Breakout Boards . . . . . . . . . . . . . . . . . 27

Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Appendix B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Appendix C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

ATTENTION!

Great care should be taken when disconnecting the

ArrayJ PCBs from the mating connectors, either on one

of the BOBs, or the user’s own boards.

The board should be gently levered up, working

progressively around the board to lever the PCB from the

connector a little on all sides, and then repeating the

process until the connectors are free from each other.

Use of Scintillators with the ArrayJ

Products

Please consult the Application Note on the use of

scintillators with the TSV arrays.

* The fast output is not available on the 2x2 array (ARRAYJ−60035−4P).

Publication Order Number:

January, 2019 − Rev. 6

ARRAYJ−SERIES/D

12 3 4 5 6 7...32

中文翻译

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与ARRAYJ-30035-64P-PCB相关器件

型号	品牌	获取价格	描述	数据表
ARRAYJ-300XX-16P-PCB	ONSEMI	获取价格	Silicon Photomultiplier (SiPM) High Fill-Factor Arrays
ARRAYJ-300XX-64P-PCB	ONSEMI	获取价格	Silicon Photomultiplier (SiPM) High Fill-Factor Arrays
ARRAYJ-40035-64P-PCB	ONSEMI	获取价格	硅光电倍增阵列，J 系列 (SiPM)
ARRAYJ-60035-4P-BGA	ONSEMI	获取价格	Silicon Photomultiplier (SiPM) High Fill-Factor Arrays
ARRAYJ-60035-4P-PCB	ONSEMI	获取价格	Silicon Photomultiplier (SiPM) High Fill-Factor Arrays
ARRAYJ-60035-64P-PCB	ONSEMI	获取价格	Silicon Photomultiplier (SiPM) High Fill-Factor Arrays
ARRAYJ-BOB3-16P	ONSEMI	获取价格	Silicon Photomultiplier (SiPM) High Fill-Factor Arrays
ARRAYJ-BOB3-64P	ONSEMI	获取价格	Silicon Photomultiplier (SiPM) High Fill-Factor Arrays
ARRAYRDM-0112A20	ONSEMI	获取价格	Silicon Photomultipliers (SiPM), RDM-Series 1 x 12 Monolithic Array
ARRAYRDM-0112A20-GEVB	ONSEMI	获取价格	Silicon Photomultipliers (SiPM), RDM-Series 1 x 12 Monolithic Array

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