Datasheet > ARRAYJ-300XX-64P-PCB

ARRAYJ-300XX-64P-PCB

更新时间： 2024-11-27 02:49:23

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
32页	5764K
描述
Silicon Photomultiplier (SiPM) High Fill-Factor Arrays

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

ARRAYJ-300XX-64P-PCB 数据手册

浏览型号ARRAYJ-300XX-64P-PCB的Datasheet PDF文件第2页

浏览型号ARRAYJ-300XX-64P-PCB的Datasheet PDF文件第3页

浏览型号ARRAYJ-300XX-64P-PCB的Datasheet PDF文件第4页

浏览型号ARRAYJ-300XX-64P-PCB的Datasheet PDF文件第5页

浏览型号ARRAYJ-300XX-64P-PCB的Datasheet PDF文件第6页

浏览型号ARRAYJ-300XX-64P-PCB的Datasheet PDF文件第7页

ArrayJ Series

Silicon Photomultiplier

(SiPM) High Fill-Factor

Arrays

ON Semiconductor’s range of J−Series SiPM sensors have been

used to create high fill−factor, scaleable arrays. The sensors are

mounted onto PCB boards with minimal dead space, forming arrays

with industry−leading fill factor of up to 90%.

www.onsemi.com

The back of each ArrayJ has either one or more multi−way

connectors, or a BGA (ball grid array). These allow access to the fast

output* and standard I/O from each pixel in the array, and a common

I/O from the summed substrates of the pixels.

The ArrayJ products with connectors can be used to interface with

the user’s own readout via a mating connector, or to a

ON Semiconductor Breakout Board (BOB). The BOBs allow for easy

access to the pixel signals and performance evaluation of the arrays.

ArrayJ products with the BGA can be reflow soldered to the user’s

readout boards, or purchased ready−mounted on a pinned PCB

evaluation board for easy testing. A BGA ArrayJ cannot be removed

from it’s PCB evaluation board. This contrasts with an ArrayJ with

connectors, as multiple arrays can be evaluated with a single BOB.

Common

ArrayJ Inputs and Outputs (I/O)

Figure 1 summarizes the array schematic for a portion of an ArrayJ.

Each SiPM sensor in the array has three electrical connections: fast

output, standard output and common.

Sn+1

Fn+1

Sn+2

Fn+2

The substrates (cathodes) of all sensors are summed together to

form the common I/O.

Each individual fast output and standard I/O (anode) are routed to its

own output pin.

The pixel−level performance of the sensors in the array can be found

in the J−Series datasheet.

Figure 1. Signal connections at the pixel

level on the ArrayJ products.

Table of Contents

ARRAYJ-60035-64P-PCB (8 X 8 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 2

ARRAYX-BOB6-64P (Breakout Board for the ARRAYJ-60035-64P) . . . . . . . . . 5

ARRAYX-BOB6-64S (Summed Breakout Board for the ARRAYJ-60035-64P) . . . 7

ARRAYJ-60035-4P-BGA (2 X 2 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 9

ARRAYJ-60035-4P-PCB (2 X 2 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 12

ARRAYJ-300XX-16P-PCB (4 X 4 Array of 3 mm Pixels) . . . . . . . . . . . . . . . . . . 17

ARRAYJ-BOB3-16P (ARRAYJ-300XX-16P Breakout Board) . . . . . . . . . . . . . . 19

ARRAYJ-300XX-64P-PCB (8 X 8 Array of 3 mm Pixels) . . . . . . . . . . . . . . . . . . 21

ARRAYJ-BOB3-64P (ARRAYJ-300XX-64P & ARRAYJ-40035-64P

Breakout Board) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Biasing and Readout from the Standard Breakout Boards . . . . . . . . . . . . . . . . . 27

Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Appendix B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Appendix C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

ATTENTION!

Great care should be taken when disconnecting the

ArrayJ PCBs from the mating connectors, either on one

of the BOBs, or the user’s own boards.

The board should be gently levered up, working

progressively around the board to lever the PCB from the

connector a little on all sides, and then repeating the

process until the connectors are free from each other.

Use of Scintillators with the ArrayJ

Products

Please consult the Application Note on the use of

scintillators with the TSV arrays.

* The fast output is not available on the 2x2 array (ARRAYJ−60035−4P).

Publication Order Number:

January, 2019 − Rev. 6

ARRAYJ−SERIES/D

12 3 4 5 6 7...32

中文翻译

下载PDF

与ARRAYJ-300XX-64P-PCB相关器件

型号	品牌	获取价格	描述	数据表
ARRAYJ-40035-64P-PCB	ONSEMI	获取价格	硅光电倍增阵列，J 系列 (SiPM)
ARRAYJ-60035-4P-BGA	ONSEMI	获取价格	Silicon Photomultiplier (SiPM) High Fill-Factor Arrays
ARRAYJ-60035-4P-PCB	ONSEMI	获取价格	Silicon Photomultiplier (SiPM) High Fill-Factor Arrays
ARRAYJ-60035-64P-PCB	ONSEMI	获取价格	Silicon Photomultiplier (SiPM) High Fill-Factor Arrays
ARRAYJ-BOB3-16P	ONSEMI	获取价格	Silicon Photomultiplier (SiPM) High Fill-Factor Arrays
ARRAYJ-BOB3-64P	ONSEMI	获取价格	Silicon Photomultiplier (SiPM) High Fill-Factor Arrays
ARRAYRDM-0112A20	ONSEMI	获取价格	Silicon Photomultipliers (SiPM), RDM-Series 1 x 12 Monolithic Array
ARRAYRDM-0112A20-GEVB	ONSEMI	获取价格	Silicon Photomultipliers (SiPM), RDM-Series 1 x 12 Monolithic Array
ARRAYRDM-0112A20-QFN	ONSEMI	获取价格	Silicon Photomultipliers (SiPM), RDM-Series 1 x 12 Monolithic Array
ARRAYRDM-0112A20-QFN-TR	ONSEMI	获取价格	Silicon Photomultipliers (SiPM), RDM-Series 1 x 12 Monolithic Array

与ARRAYJ-300XX-64P-PCB相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

45
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

34
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

62
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

59

产品中心

服务支持

精选活动

关于我们

帮助中心

ARRAYJ-300XX-64P-PCB

ARRAYJ-300XX-64P-PCB 数据手册

与ARRAYJ-300XX-64P-PCB相关器件

与ARRAYJ-300XX-64P-PCB相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

ARRAYJ-300XX-64P-PCB

ARRAYJ-300XX-64P-PCB 数据手册

与ARRAYJ-300XX-64P-PCB相关器件

与ARRAYJ-300XX-64P-PCB相关文章

您还可以找

您在本页遇到什么问题？