ArrayC Series
Silicon Photomultiplier
(SiPM) 4-Side Scaleable
Arrays
ON Semiconductor’s range of C-Series, SMT (surface mount
technology) SiPM sensors have been used to create compact and
scaleable arrays. The sensors are mounted onto PCB boards with
minimal dead space. The ArrayC products are available in a variety of
formats, and formed of pixels of different sizes. Details of the arrays
available are given in the Ordering Information table on page 29 of
this document.
www.onsemi.com
The back of each ArrayC has either one or more multi-way
connectors, or a BGA (ball grid array), that allow access to the fast
output* and standard I/O from each pixel in the array, and a common
I/O from the summed substrates of the pixels. The ArrayC products
with connectors can be used to interface with the user’s own readout
via the mating connector, or to ON Semiconductor’s Breakout Boards
(BOBs). The BOBs allow for easy access to the pixel signals and
performance evaluation of the arrays.
ArrayC products with the BGA can be reflow soldered to the user’s
readout boards, or purchased ready-mounted on an Evaluation Board
(EVB) for easy testing. The BGA ArrayC products cannot be removed
from their EVBs. This contrasts with an ArrayC that has connectors,
where multiple arrays can be evaluated with a single BOB.
S1
S2
F1
F2
Common
Sn+1
Sn+2
Fn+2
ArrayC Inputs and Outputs (I/O)
Figure 1 summarizes the array schematic for a portion of an ArrayC.
Each SiPM sensor in the array has three electrical connections: fast
output*, standard output and common.
Fn+1
The substrates (cathodes) of all sensors are summed together to
form the common I/O.
Each individual fast output* and standard I/O (anode) are routed to
its own output pin.
Figure 1. Signal connections at the pixel
level of an ArrayC
The pixel-level performance of the sensors in the array can be found
in the C-Series datasheet.
ATTENTION!
Table of Contents
Great care should be taken when disconnecting the
ArrayC PCBs from the mating connectors, either on one
of the BOBs, or the user’s own boards.
ARRAYC−60035−4P−BGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
ARRAYC−60035−4P−GEVB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
ARRAYC−60035−64P−PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
ARRAYX−BOB6−64S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
ARRAYX−BOB6−64S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
ARRAYC−30035−16P−PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
ARRAYX−BOB3−16P . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
ARRAYX−BOB3−16S . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
ARRAYC−30035−144P−PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
ARRAYX−BOB3−144P . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Biasing and Readout from the Standard Breakout Boards . . . . 24
Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Appendix B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Appendix C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
The board should be gently levered up, working
progressively around the board to lever the PCB from the
connector a little on all sides, and then repeating the
process until the connectors are free from each other.
Note that a BGA ArrayC cannot be removed from its EVB.
* The ARRAYC-60035-4P does not have access to the fast output.
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
March, 2019 − Rev. 7
ARRAYC−SERIES/D
5秒后页面跳转
解析光耦仿真器：升级光耦合器技术的必要性
英伟达新一代Blackwell GPU过热问题致交付延迟
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
