ArrayJ Series
Silicon Photomultiplier
(SiPM) High Fill-Factor
Arrays
ON Semiconductor’s range of J−Series SiPM sensors have been
used to create high fill−factor, scaleable arrays. The sensors are
mounted onto PCB boards with minimal dead space, forming arrays
with industry−leading fill factor of up to 90%.
www.onsemi.com
The back of each ArrayJ has either one or more multi−way
connectors, or a BGA (ball grid array). These allow access to the fast
output* and standard I/O from each pixel in the array, and a common
I/O from the summed substrates of the pixels.
The ArrayJ products with connectors can be used to interface with
the user’s own readout via a mating connector, or to a
ON Semiconductor Breakout Board (BOB). The BOBs allow for easy
access to the pixel signals and performance evaluation of the arrays.
ArrayJ products with the BGA can be reflow soldered to the user’s
readout boards, or purchased ready−mounted on a pinned PCB
evaluation board for easy testing. A BGA ArrayJ cannot be removed
from it’s PCB evaluation board. This contrasts with an ArrayJ with
connectors, as multiple arrays can be evaluated with a single BOB.
S1
S2
F1
F2
Common
ArrayJ Inputs and Outputs (I/O)
Figure 1 summarizes the array schematic for a portion of an ArrayJ.
Each SiPM sensor in the array has three electrical connections: fast
output, standard output and common.
Sn+1
Fn+1
Sn+2
Fn+2
The substrates (cathodes) of all sensors are summed together to
form the common I/O.
Each individual fast output and standard I/O (anode) are routed to its
own output pin.
The pixel−level performance of the sensors in the array can be found
in the J−Series datasheet.
Figure 1. Signal connections at the pixel
level on the ArrayJ products.
Table of Contents
ARRAYJ-60035-64P-PCB (8 X 8 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 2
ARRAYX-BOB6-64P (Breakout Board for the ARRAYJ-60035-64P) . . . . . . . . . 5
ARRAYX-BOB6-64S (Summed Breakout Board for the ARRAYJ-60035-64P) . . . 7
ARRAYJ-60035-4P-BGA (2 X 2 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 9
ARRAYJ-60035-4P-PCB (2 X 2 Array of 6 mm Pixels) . . . . . . . . . . . . . . . . . . . . 12
ARRAYJ-300XX-16P-PCB (4 X 4 Array of 3 mm Pixels) . . . . . . . . . . . . . . . . . . 17
ARRAYJ-BOB3-16P (ARRAYJ-300XX-16P Breakout Board) . . . . . . . . . . . . . . 19
ARRAYJ-300XX-64P-PCB (8 X 8 Array of 3 mm Pixels) . . . . . . . . . . . . . . . . . . 21
ARRAYJ-BOB3-64P (ARRAYJ-300XX-64P & ARRAYJ-40035-64P
Breakout Board) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Biasing and Readout from the Standard Breakout Boards . . . . . . . . . . . . . . . . . 27
Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Appendix B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Appendix C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
ATTENTION!
Great care should be taken when disconnecting the
ArrayJ PCBs from the mating connectors, either on one
of the BOBs, or the user’s own boards.
The board should be gently levered up, working
progressively around the board to lever the PCB from the
connector a little on all sides, and then repeating the
process until the connectors are free from each other.
Use of Scintillators with the ArrayJ
Products
Please consult the Application Note on the use of
scintillators with the TSV arrays.
* The fast output is not available on the 2x2 array (ARRAYJ−60035−4P).
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
January, 2019 − Rev. 6
ARRAYJ−SERIES/D
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