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APTGT75X60T3G-Module PDF预览

APTGT75X60T3G-Module

更新时间: 2024-11-06 14:53:39
品牌 Logo 应用领域
美国微芯 - MICROCHIP 双极性晶体管
页数 文件大小 规格书
6页 317K
描述
Configuration: Three Phase bridgeVCES (V): 600VCESat (V): 1.5Current (A) Tc=80C: 75Silicon type: TRENCH 3 IGBT Package: SP3F

APTGT75X60T3G-Module 数据手册

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APTGT75X60T3G  
3 Phase bridge  
Trench + Field Stop IGBT3  
Power Module  
VCES = 600V  
IC = 75A* @ Tc = 80°C  
15  
16  
19  
31  
23  
25  
29  
30  
Application  
14  
Motor control  
20  
18  
22  
28  
R1  
Features  
Trench + Field Stop IGBT3 Technology  
8
7
4
3
-
-
-
-
-
Low voltage drop  
Low tail current  
Switching frequency up to 20 kHz  
Low leakage current  
RBSOA and SCSOA rated  
11  
13  
10  
12  
2
It is recommended to connect a decoupling capacitor  
Kelvin emitter for easy drive  
Very low stray inductance  
Internal thermistor for temperature monitoring  
between pins 31 & 2 to reduce switching overvoltages, if DC  
Power is connected between pins 15, 16 & 12.  
Pins 15 & 16 must be shorted together.  
Benefits  
Outstanding performance at high frequency  
operation  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Solderable terminals both for power and signal  
for easy PCB mounting  
Low profile  
RoHS compliant  
All ratings @ Tj = 25°C unless otherwise specified  
Absolute maximum ratings (Per IGBT)  
Symbol  
Parameter  
Max ratings  
Unit  
V
VCES  
Collector - Emitter Voltage  
Continuous Collector Current  
600  
100*  
75*  
150  
±20  
250  
TC = 25°C  
TC = 80°C  
TC = 25°C  
IC  
A
ICM  
VGE  
PD  
Pulsed Collector Current  
Gate – Emitter Voltage  
Power Dissipation  
V
W
TC = 25°C  
TJ = 150°C  
RBSOA Reverse Bias Safe Operating Area  
150A @ 550V  
* Specification of IGBT device but output current must be limited due to size of output pin.  
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
1 - 6  
www.microsemi.com  

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