是否Rohs认证: | 符合 | 生命周期: | Obsolete |
包装说明: | FLANGE MOUNT, R-XUFM-T12 | 针数: | 12 |
Reach Compliance Code: | unknown | 风险等级: | 5.84 |
外壳连接: | ISOLATED | 最大集电极电流 (IC): | 32 A |
集电极-发射极最大电压: | 600 V | 配置: | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR |
门极-发射极最大电压: | 20 V | JESD-30 代码: | R-XUFM-T12 |
JESD-609代码: | e1 | 湿度敏感等级: | 1 |
元件数量: | 2 | 端子数量: | 12 |
最高工作温度: | 175 °C | 封装主体材料: | UNSPECIFIED |
封装形状: | RECTANGULAR | 封装形式: | FLANGE MOUNT |
峰值回流温度(摄氏度): | NOT SPECIFIED | 极性/信道类型: | N-CHANNEL |
最大功率耗散 (Abs): | 62 W | 认证状态: | Not Qualified |
子类别: | Insulated Gate BIP Transistors | 表面贴装: | NO |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | THROUGH-HOLE |
端子位置: | UPPER | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
晶体管应用: | MOTOR CONTROL | 晶体管元件材料: | SILICON |
标称断开时间 (toff): | 310 ns | 标称接通时间 (ton): | 170 ns |
VCEsat-Max: | 1.9 V | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
APTGT20DDA60T3 | ADPOW |
获取价格 |
Dual Boost chopper Trench + Field Stop IGBT Power Module | |
APTGT20DDA60T3G | MICROSEMI |
获取价格 |
Dual Boost chopper Trench + Field Stop IGBT Power Module | |
APTGT20DSK60T3 | ADPOW |
获取价格 |
Dual Buck chopper Trench + Field Stop IGBT Power Module | |
APTGT20DSK60T3G | MICROSEMI |
获取价格 |
Dual Buck chopper Trench + Field Stop IGBT Power Module | |
APTGT20H60T1G | MICROSEMI |
获取价格 |
Full bridge Trench + Field Stop IGBT® Power M | |
APTGT20H60T1G-Module | MICROCHIP |
获取价格 |
Configuration: Full bridgeVCES (V): 600VCESat (V): 1.5Current (A) Tc=80C: 20Silicon type: | |
APTGT20H60T3 | ADPOW |
获取价格 |
Full - Bridge Trench + Field Stop IGBT Power Module | |
APTGT20H60T3G | MICROSEMI |
获取价格 |
Full - Bridge Trench + Field Stop IGBT Power Module | |
APTGT20TL601G | MICROSEMI |
获取价格 |
Three level inverter Trench + Field Stop IGBT Power Module | |
APTGT20TL601G-Module | MICROCHIP |
获取价格 |
Configuration: Three level inverterVCES (V): 600VCESat (V): 1.5Current (A) Tc=80C: 20Silic |