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APTC60DAM35T1G PDF预览

APTC60DAM35T1G

更新时间: 2024-11-24 06:37:27
品牌 Logo 应用领域
美高森美 - MICROSEMI /
页数 文件大小 规格书
6页 313K
描述
Boost chopper Super Junction MOSFET Power Module

APTC60DAM35T1G 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:ROHS COMPLIANT, SP1, 12 PIN针数:12
Reach Compliance Code:unknown风险等级:5.84
其他特性:AVALANCHE RATED雪崩能效等级(Eas):1800 mJ
配置:SINGLE WITH BUILT-IN DIODE AND THERMISTOR最小漏源击穿电压:600 V
最大漏极电流 (Abs) (ID):72 A最大漏极电流 (ID):72 A
最大漏源导通电阻:0.035 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-XUFM-T12JESD-609代码:e1
湿度敏感等级:1元件数量:1
端子数量:12工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):416 W最大脉冲漏极电流 (IDM):200 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:TIN SILVER COPPER
端子形式:THROUGH-HOLE端子位置:UPPER
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:CHOPPER
晶体管元件材料:SILICONBase Number Matches:1

APTC60DAM35T1G 数据手册

 浏览型号APTC60DAM35T1G的Datasheet PDF文件第2页浏览型号APTC60DAM35T1G的Datasheet PDF文件第3页浏览型号APTC60DAM35T1G的Datasheet PDF文件第4页浏览型号APTC60DAM35T1G的Datasheet PDF文件第5页浏览型号APTC60DAM35T1G的Datasheet PDF文件第6页 
APTC60DAM35T1G  
VDSS = 600V  
Boost chopper  
Super Junction MOSFET  
Power Module  
R
DSon = 35mmax @ Tj = 25°C  
ID = 72A @ Tc = 25°C  
5
6
11  
Application  
AC and DC motor control  
Switched Mode Power Supplies  
Power Factor Correction  
CR1  
Q2  
Features  
3
4
NTC  
-
-
-
-
-
Ultra low RDSon  
Low Miller capacitance  
Ultra low gate charge  
Avalanche energy rated  
Very rugged  
9
10  
Very low stray inductance  
Internal thermistor for temperature monitoring  
High level of integration  
1
2
12  
Benefits  
Outstanding performance at high frequency operation  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Solderable terminals both for power and signal for  
easy PCB mounting  
Low profile  
RoHS Compliant  
Pins 1/2 ; 3/4 ; 5/6 must be shorted together  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
Unit  
VDSS  
Drain - Source Breakdown Voltage  
600  
72  
V
Tc = 25°C  
ID  
Continuous Drain Current  
A
Tc = 80°C  
54  
IDM  
VGS  
RDSon  
Pulsed Drain current  
Gate - Source Voltage  
Drain - Source ON Resistance  
200  
±20  
35  
V
m  
W
PD  
IAR  
EAR  
EAS  
Maximum Power Dissipation  
Tc = 25°C  
416  
20  
1
1800  
Avalanche current (repetitive and non repetitive)  
A
Repetitive Avalanche Energy  
mJ  
Single Pulse Avalanche Energy  
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note  
APT0502 on www.microsemi.com  
1 – 6  
www.microsemi.com  

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