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AFE1115E/1K PDF预览

AFE1115E/1K

更新时间: 2024-10-28 20:00:39
品牌 Logo 应用领域
德州仪器 - TI 电信光电二极管电信集成电路
页数 文件大小 规格书
14页 168K
描述
DATACOM, DIGITAL SLIC, PDSO56, PLASTIC, SSOP-56

AFE1115E/1K 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:SSOP包装说明:SSOP, SSOP56,.4
针数:56Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.75
数据速率:1168 MbpsJESD-30 代码:R-PDSO-G56
JESD-609代码:e0长度:18.415 mm
湿度敏感等级:3功能数量:1
端子数量:56最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:SSOP封装等效代码:SSOP56,.4
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度):220电源:3.3/5,5 V
认证状态:Not Qualified座面最大高度:2.794 mm
子类别:Other Telecom ICs标称供电电压:3.3 V
表面贴装:YES技术:CMOS
电信集成电路类型:DIGITAL SLIC温度等级:INDUSTRIAL
端子面层:TIN LEAD端子形式:GULL WING
端子节距:0.635 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:7.5 mm
Base Number Matches:1

AFE1115E/1K 数据手册

 浏览型号AFE1115E/1K的Datasheet PDF文件第8页浏览型号AFE1115E/1K的Datasheet PDF文件第9页浏览型号AFE1115E/1K的Datasheet PDF文件第10页浏览型号AFE1115E/1K的Datasheet PDF文件第11页浏览型号AFE1115E/1K的Datasheet PDF文件第12页浏览型号AFE1115E/1K的Datasheet PDF文件第14页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
3-Oct-2003  
PACKAGING INFORMATION  
ORDERABLE DEVICE  
STATUS(1)  
PACKAGE TYPE  
PACKAGE DRAWING  
PINS  
PACKAGE QTY  
AFE1115E  
ACTIVE  
ACTIVE  
SSOP  
SSOP  
DL  
DL  
56  
56  
27  
AFE1115E/1K  
1000  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  

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