Datasheet > ADSP-21363KBCZ-1AA

ADSP-21363KBCZ-1AA

更新时间： 2024-02-05 11:51:16

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
52页	2274K
描述
SHARC Processor

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中文翻译

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数据手册
替代型号

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ADSP-21363KBCZ-1AA 数据手册

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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366

OUTLINE DIMENSIONS

The ADSP-2136x is available in a 136-ball BGA package.

10.40 BSC SQ

12.00 BSC SQ

0.80

BSC

TYP

PIN A1 INDICATOR

0.80

BSC

TYP

14 13 12 11 10 9 8

7 6 5 4 3 2 1

BOTTOM VIEW

TOP VIEW

1.70

MAX

DETAIL A

0.25

MIN

SEATING

PLANE

0.50

0.45

1. DIMENSIONS ARE IN MILIMETERS (MM).

2. THE ACTUAL POSITION OF THE BALL GRID IS

WITHIN 0.15 MM OF ITS IDEAL POSITION RELATIVE

TO THE PACKAGE EDGES.

3. COMPLIANT TO JEDEC STANDARD MO-205-AE, EXCEPT FOR

THE BALL DIAMETER.

0.40

0.12 MAX (BALL

COPLANARITY)

(BALL

DIAMETER)

4. CENTER DIMENSIONS ARE NOMINAL.

DETAIL A

Figure 45. 136-Ball Chip Scale Package Ball Grid Array [CSP_BGA](BC-136-2)

SURFACE MOUNT DESIGN

Table 44 is provided as an aide to PCB design. For industry-

standard design recommendations, refer to IPC-7351, Generic

Requirements for Surface Mount Design and Land Pattern

Standard.

Table 44. BGA Data for Use with Surface Mount Design

Package

Ball Attach Type

Solder Mask Opening

Ball Pad Size

136-Ball Grid Array (BC-136-2)

Solder Mask Defined

0.40 mm diameter

0.53 mm diameter

Rev. A

Page 51 of 52

December 2006

1...48 49 505152

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ADSP-21363KBCZ-1AA 替代型号

型号	品牌	替代类型	描述	数据表
ADSP-21363KBC-1AA	ADI	完全替代	SHARC Processor

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