Datasheet > ADSP-21363KBCZ-1AA

ADSP-21363KBCZ-1AA

更新时间： 2024-02-10 22:42:23

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
52页	2274K
描述
SHARC Processor

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数据手册
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ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366

Table 41. Thermal Characteristics for BGA (No thermal vias

in PCB)

Parameter

θ_JA

θ_JMA

θ_JC

Ψ_JT

Ψ_JMT

Condition

Typical

25.40

21.90

20.90

5.07

Unit

°C/W

Airflow = 0 m/s

Airflow = 1 m/s

Airflow = 2 m/s

Y = 0.0488x

-1.5923

Airflow = 0 m/s

Airflow = 1 m/s

Airflow = 2 m/s

0.140

0.330

0.410

Table 42. Thermal Characteristics for BGA (Thermal vias in

PCB)

100

150

200

LOAD CAPACITANCE (pF)

Parameter

θ_JA

θ_JMA

θ_JC

Ψ_JT

Ψ_JMT

Condition

Typical

23.40

20.00

19.20

5.00

Unit

°C/W

Airflow = 0 m/s

Airflow = 1 m/s

Airflow = 2 m/s

Figure 42. Typical Output Delay or Hold vs. Load Capacitance

(at Ambient Temperature)

THERMAL CHARACTERISTICS

Airflow = 0 m/s

Airflow = 1 m/s

Airflow = 2 m/s

0.130

0.300

0.360

The ADSP-2136x processor is rated for performance over the

temperature range specified in Operating Conditions

on Page 16.

Table 41 and Table 42 airflow measurements comply with

JEDEC standards JESD51-2 and JESD51-6 and the junction-to-

board measurement complies with JESD51-8. Test board and

thermal via design comply with JEDEC standards JESD51-9

(BGA). The junction-to-case measurement complies with MIL-

STD-883. All measurements use a 2S2P JEDEC test board.

Industrial applications using the BGA package require thermal

vias, to an embedded ground plane, in the PCB. Refer to JEDEC

standard JESD51-9 for printed circuit board thermal ball land

and thermal via design information.

To determine the junction temperature of the device while on

the application PCB, use:

T_J= T_T+ (Ψ_JT× P_D)

where:

T_J= junction temperature (°C)

T_T= case temperature (°C) measured at the top center of the

package

Ψ_JT= junction-to-top (of package) characterization parameter

is the typical value from Table 41.

P_D= power dissipation (see EE Note No. EE-277 for more

information).

Values of θ_JAare provided for package comparison and PCB

design considerations.

Values of θ_JCare provided for package comparison and PCB

design considerations when an external heat sink is required.

Note that the thermal characteristics values provided in

Table 41 and Table 42 are modeled values.

Rev. A

Page 47 of 52

December 2006

1...44 45 464748 49 50...52

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ADSP-21363KBCZ-1AA 替代型号

型号	品牌	替代类型	描述	数据表
ADSP-21363KBC-1AA	ADI	完全替代	SHARC Processor

与ADSP-21363KBCZ-1AA相关器件

型号	品牌	获取价格	描述	数据表
ADSP-21363KSQZ-1AA	ADI	获取价格	IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, LEAD FREE, MS-026BFB-HD, LQFP-144, Digital Signa
ADSP-21363KSQZ-1AX	ADI	获取价格	IC 16-BIT, 55.55 MHz, OTHER DSP, PQFP144, LEAD FREE, MS-026BFB-HD, LQFP-144, Digital Signa
ADSP-21363KSWZ-1AA	ADI	获取价格	SHARC Processors
ADSP-21363SBBC-ENG	ADI	获取价格	SHARC Processor
ADSP-21363SBBCZENG	ADI	获取价格	SHARC Processor
ADSP-21363SBSQ-ENG	ADI	获取价格	SHARC Processor
ADSP-21363SBSQZENG	ADI	获取价格	SHARC Processor
ADSP-21363SCSQ-ENG	ADI	获取价格	SHARC Processor
ADSP-21363SCSQZENG	ADI	获取价格	SHARC Processor
ADSP-21363SKBC-ENG	ADI	获取价格	SHARC Processor

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