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AD9548BCPZ-REEL7 PDF预览

AD9548BCPZ-REEL7

更新时间: 2024-10-28 06:36:15
品牌 Logo 应用领域
亚德诺 - ADI 晶体时钟发生器微控制器和处理器外围集成电路
页数 文件大小 规格书
112页 1935K
描述
Quad/Octal Input Network Clock Generator/Synchronizer

AD9548BCPZ-REEL7 数据手册

 浏览型号AD9548BCPZ-REEL7的Datasheet PDF文件第103页浏览型号AD9548BCPZ-REEL7的Datasheet PDF文件第104页浏览型号AD9548BCPZ-REEL7的Datasheet PDF文件第105页浏览型号AD9548BCPZ-REEL7的Datasheet PDF文件第107页浏览型号AD9548BCPZ-REEL7的Datasheet PDF文件第108页浏览型号AD9548BCPZ-REEL7的Datasheet PDF文件第109页 
AD9548  
THERMAL PERFORMANCE  
Table 154. Thermal Parameters for the AD9548 88-Lead LFCSP Package  
Symbol  
Thermal Characteristic Using a JEDEC51-7 Plus JEDEC51-5 2S2P Test Board1  
Value2 Unit  
θJA  
Junction-to-ambient thermal resistance, 0.0 m/s airflow per JEDEC JESD51-2 (still air)  
Junction-to-ambient thermal resistance, 1.0 m/s airflow per JEDEC JESD51-6 (moving air)  
Junction-to-ambient thermal resistance, 2.5 m/s airflow per JEDEC JESD51-6 (moving air)  
Junction-to-board thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-8 (moving air)  
Junction-to-case thermal resistance (die-to-heat sink) per MIL-Std 883, Method 1012.1  
Junction-to-top-of-package characterization parameter, 0 m/sec airflow per JEDEC JESD51-2 (still air)  
18  
16  
14  
9
1.0  
0.1  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
θJMA  
θJMA  
θJB  
θJC  
ΨJT  
1 The exposed pad on the bottom of the package must be soldered to ground to achieve the specified thermal performance.  
2 Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the  
application to determine if they are similar to those assumed in these calculations.  
The AD9548 is specified for a case temperature (TCASE). To ensure  
that TCASE is not exceeded, an airflow source can be used. Use the  
following equation to determine the junction temperature on the  
application PCB:  
Values of θJA are provided for package comparison and PCB  
design considerations. θJA can be used for a first order approx-  
imation of TJ by the equation  
TJ = TA + (θJA × PD)  
TJ = TCASE + (ΨJT × PD)  
where TA is the ambient temperature (°C).  
where:  
Values of θJC are provided for package comparison and PCB  
design considerations when an external heat sink is required.  
TJ is the junction temperature (°C).  
TCASE is the case temperature (°C) measured by the customer at the  
Values of θJB are provided for package comparison and PCB design  
considerations.  
top center of the package.  
ΨJT is the value as indicated in Table 154.  
PD is the power dissipation (see the Power Dissipation section).  
Rev. 0 | Page 106 of 112  
 
 
 

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