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934055227135 PDF预览

934055227135

更新时间: 2024-11-25 14:47:23
品牌 Logo 应用领域
恩智浦 - NXP 开关光电二极管晶体管
页数 文件大小 规格书
9页 186K
描述
1520mA, 12V, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, SC-74, 6 PIN

934055227135 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:SC-74包装说明:SC-74, 6 PIN
针数:6Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8541.21.00.95
风险等级:5.75其他特性:LOGIC LEVEL COMPATIBLE
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:12 V
最大漏极电流 (ID):1.52 A最大漏源导通电阻:0.15 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-G6
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:6
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:P-CHANNEL
认证状态:Not Qualified表面贴装:YES
端子面层:PURE TIN端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

934055227135 数据手册

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Philips Semiconductors  
Product specification  
P-channel enhancement mode  
MOS transistor  
BSH207  
FEATURES  
SYMBOL  
QUICK REFERENCE DATA  
s
• Very low threshold voltage  
• Fast switching  
VDS = -12 V  
• Logic level compatible  
• Subminiature surface mount  
package  
ID = -1.52 A  
g
R
DS(ON) 0.15 (VGS = -2.5 V)  
VGS(TO) 0.4 V  
d
GENERAL DESCRIPTION  
PINNING  
SOT457  
P-channel, enhancement mode,  
logic level, field-effect power  
transistor. This device has low  
threshold voltage and extremely  
fast switching making it ideal for  
battery powered applications and  
high speed digital interfacing.  
PIN  
DESCRIPTION  
6
5
4
1,2,5,6 drain  
Top view  
3
4
gate  
source  
1
2
3
The BSH207 is supplied in the  
SOT457 subminiature surface  
mounting package.  
LIMITING VALUES  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
SYMBOL PARAMETER  
CONDITIONS  
MIN.  
MAX.  
UNIT  
VDS  
VDGR  
VGS  
ID  
Drain-source voltage  
-
-
-
-
-
-
-
-
-12  
-12  
± 8  
-1.52  
-0.96  
-6.09  
0.417  
0.17  
150  
V
V
V
A
A
Drain-gate voltage  
Gate-source voltage  
Drain current (DC)  
RGS = 20 kΩ  
Ta = 25 ˚C  
Ta = 100 ˚C  
Ta = 25 ˚C  
Ta = 25 ˚C  
Ta = 100 ˚C  
IDM  
Ptot  
Drain current (pulse peak value)  
Total power dissipation  
A
W
W
˚C  
Tstg, Tj  
Storage & operating temperature  
- 55  
THERMAL RESISTANCES  
SYMBOL PARAMETER  
CONDITIONS  
TYP.  
MAX.  
UNIT  
Rth j-a  
Thermal resistance junction to  
ambient  
FR4 board, minimum  
footprint  
300  
-
K/W  
August 1998  
1
Rev 1.000  

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