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74LVT16244BDGG,518 PDF预览

74LVT16244BDGG,518

更新时间: 2024-12-01 14:47:07
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
18页 213K
描述
74LVT16244B; 74LVTH16244B - 3.3 V 16-bit buffer/driver; 3-state TSSOP 48-Pin

74LVT16244BDGG,518 技术参数

是否Rohs认证:符合生命周期:Transferred
零件包装代码:TSSOP包装说明:TSSOP, TSSOP48,.3,20
针数:48Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.15
Is Samacsys:N控制类型:ENABLE LOW
系列:LVTJESD-30 代码:R-PDSO-G48
JESD-609代码:e4长度:12.5 mm
负载电容(CL):50 pF逻辑集成电路类型:BUS DRIVER
最大I(ol):0.064 A湿度敏感等级:2
位数:4功能数量:4
端口数量:2端子数量:48
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP48,.3,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH包装方法:TAPE AND REEL
峰值回流温度(摄氏度):260电源:3.3 V
Prop。Delay @ Nom-Sup:3.2 ns传播延迟(tpd):4 ns
认证状态:Not Qualified座面最大高度:1.2 mm
子类别:Bus Driver/Transceivers最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:BICMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:30
宽度:6.1 mmBase Number Matches:1

74LVT16244BDGG,518 数据手册

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74LVT16244B; 74LVTH16244B  
3.3 V 16-bit buffer/driver; 3-state  
Rev. 11 — 1 March 2012  
Product data sheet  
1. General description  
The 74LVT16244B; 74LVTH16244B is a high-performance BiCMOS product designed for  
CC operation at 3.3 V.  
V
This device is a 16-bit buffer and line driver featuring non-inverting 3-state bus outputs.  
The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer.  
2. Features and benefits  
16-bit bus interface  
3-state buffers  
Output capability: +64 mA and 32 mA  
TTL input and output switching levels  
Input and output interface capability to systems at 5 V supply  
Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs  
Power-up 3-state  
Live insertion and extraction permitted  
No bus current loading when output is tied to 5 V bus  
Latch-up protection  
JESD78B Class II exceeds 500 mA  
ESD protection:  
HBM JESD22-A114F exceeds 2000 V  
MM JESD22-A115-A exceeds 200 V  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74LVT16244BDL  
74LVTH16244BDL  
74LVT16244BDGG  
74LVTH16244BDGG  
74LVT16244BEV  
40 C to +85 C  
SSOP48  
plastic shrink small outline package; 48 leads; SOT370-1  
body width 7.5 mm  
40 C to +85 C  
TSSOP48  
plastic thin shrink small outline package;  
48 leads; body width 6.1 mm  
SOT362-1  
40 C to +85 C  
40 C to +125 C  
VFBGA56  
HXQFN60  
plastic very thin fine-pitch ball grid array  
SOT702-1  
package; 56 balls; body 4.5 7 0.65 mm  
74LVT16244BBX  
74LVTH16244BBX  
plastic compatible thermal enhanced extremely SOT1134-2  
thin quad flat package; no leads; 60 terminals;  
body 4 6 0.5 mm  
 
 
 

74LVT16244BDGG,518 替代型号

型号 品牌 替代类型 描述 数据表
74LVT16244BDGG,118 NXP

完全替代

74LVT16244B; 74LVTH16244B - 3.3 V 16-bit buffer/driver; 3-state TSSOP 48-Pin

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