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74LVT16244BDG-T PDF预览

74LVT16244BDG-T

更新时间: 2024-12-01 20:01:35
品牌 Logo 应用领域
恩智浦 - NXP 驱动信息通信管理光电二极管输出元件逻辑集成电路
页数 文件大小 规格书
17页 100K
描述
LVT SERIES, QUAD 4-BIT DRIVER, TRUE OUTPUT, PDSO48

74LVT16244BDG-T 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:TSSOP, TSSOP48,.3,20Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.04
控制类型:ENABLE LOW系列:LVT
JESD-30 代码:R-PDSO-G48长度:12.5 mm
负载电容(CL):50 pF逻辑集成电路类型:BUS DRIVER
最大I(ol):0.064 A位数:4
功能数量:4端口数量:2
端子数量:48最高工作温度:85 °C
最低工作温度:-40 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP48,.3,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法:TAPE AND REEL电源:3.3 V
Prop。Delay @ Nom-Sup:3.2 ns传播延迟(tpd):4 ns
认证状态:Not Qualified座面最大高度:1.2 mm
子类别:Bus Driver/Transceivers最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:BICMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
宽度:6.1 mmBase Number Matches:1

74LVT16244BDG-T 数据手册

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74LVT16244B; 74LVTH16244B  
3.3 V 16-bit buffer/driver; 3-state  
Rev. 07 — 26 March 2009  
Product data sheet  
1. General description  
The 74LVT16244B; 74LVTH16244B is a high-performance BiCMOS product designed for  
VCC operation at 3.3 V.  
This device is a 16-bit buffer and line driver featuring non-inverting 3-state bus outputs.  
The device can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer.  
2. Features  
I 16-bit bus interface  
I 3-state buffers  
I Output capability: +64 mA and 32 mA  
I TTL input and output switching levels  
I Input and output interface capability to systems at 5 V supply  
I Bus hold data inputs eliminate need for external pull-up resistors to hold unused inputs  
I Power-up 3-state  
I Live insertion and extraction permitted  
I No bus current loading when output is tied to 5 V bus  
I Latch-up protection  
N JESD78 Class II exceeds 500 mA  
I ESD protection:  
N HBM JESD22-A114E exceeds 2000 V  
N MM JESD22-A115-A exceeds 200 V  
3. Ordering information  
Table 1.  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74LVT16244BDL  
74LVTH16244BDL  
74LVT16244BDGG  
74LVTH16244BDGG  
74LVT16244BEV  
40 °C to +85 °C  
40 °C to +85 °C  
SSOP48  
plastic shrink small outline package; 48 leads; SOT370-1  
body width 7.5 mm  
TSSOP48  
VFBGA56  
plastic thin shrink small outline package;  
48 leads; body width 6.1 mm  
SOT362-1  
40 °C to +85 °C  
40 °C to +85 °C  
plastic very thin fine-pitch ball grid array  
SOT702-1  
package; 56 balls; body 4.5 × 7 × 0.65 mm  
74LVT16244BBQ  
74LVTH16244BBQ  
HUQFN60U plastic thermal enhanced ultra thin quad flat  
package; no leads; 60 terminals; UTLP based;  
body 4 x 6 x 0.55 mm  
SOT1025-1  
 
 
 

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