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74LVT16244BDGVRG4 PDF预览

74LVT16244BDGVRG4

更新时间: 2024-12-01 04:47:55
品牌 Logo 应用领域
德州仪器 - TI 总线驱动器总线收发器逻辑集成电路光电二极管输出元件信息通信管理
页数 文件大小 规格书
20页 510K
描述
3.3-V ABT 16-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS

74LVT16244BDGVRG4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:TSSOP, TSSOP48,.25,16针数:48
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.24控制类型:ENABLE LOW
系列:LVTJESD-30 代码:R-PDSO-G48
JESD-609代码:e4长度:9.7 mm
负载电容(CL):50 pF逻辑集成电路类型:BUS DRIVER
最大I(ol):0.064 A湿度敏感等级:1
位数:4功能数量:4
端口数量:2端子数量:48
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP48,.25,16封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH包装方法:TAPE AND REEL
峰值回流温度(摄氏度):260电源:3.3 V
Prop。Delay @ Nom-Sup:3.2 ns传播延迟(tpd):3.7 ns
认证状态:Not Qualified座面最大高度:1.2 mm
子类别:Bus Driver/Transceivers最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:BICMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.4 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:4.4 mmBase Number Matches:1

74LVT16244BDGVRG4 数据手册

 浏览型号74LVT16244BDGVRG4的Datasheet PDF文件第2页浏览型号74LVT16244BDGVRG4的Datasheet PDF文件第3页浏览型号74LVT16244BDGVRG4的Datasheet PDF文件第4页浏览型号74LVT16244BDGVRG4的Datasheet PDF文件第5页浏览型号74LVT16244BDGVRG4的Datasheet PDF文件第6页浏览型号74LVT16244BDGVRG4的Datasheet PDF文件第7页 
SN54LVT16244B, SN74LVT16244B  
3.3-V ABT 16-BIT BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCBS716EMARCH 2000REVISED DECEMBER 2006  
FEATURES  
SN54LVT16244B . . . WD PACKAGE  
SN74LVT16244B . . . DGG, DGV, OR DL PACKAGE  
(TOP VIEW)  
Member of the Texas Instruments Widebus™  
Family  
State-of-the-Art Advanced BiCMOS  
Technology (ABT) Design for 3.3-V Operation  
and Low Static-Power Dissipation  
1
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
1OE  
1Y1  
1Y2  
GND  
1Y3  
1Y4  
2OE  
1A1  
1A2  
GND  
1A3  
1A4  
2
3
Support Mixed-Mode Signal Operation  
(5-V Input and Output Voltages With  
4
5
3.3-V VCC  
)
6
Support Unregulated Battery Operation Down  
to 2.7 V  
7
V
CC  
V
CC  
8
2Y1  
2Y2  
GND  
2Y3  
2Y4  
3Y1  
3Y2  
GND  
3Y3  
3Y4  
2A1  
2A2  
GND  
2A3  
2A4  
3A1  
3A2  
GND  
3A3  
3A4  
Typical VOLP (Output Ground Bounce) <0.8 V  
at VCC = 3.3 V, TA = 25°C  
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
Ioff and Power-Up 3-State Support Hot  
Insertion  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
V
CC  
V
CC  
1000-V Charged-Device Model (C101)  
4Y1  
4Y2  
GND  
4Y3  
4Y4  
4OE  
4A1  
4A2  
GND  
4A3  
4A4  
3OE  
DESCRIPTION/ORDERING INFORMATION  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
SN74LVT16244BGRDR  
SN74LVT16244BZRDR  
SN74LVT16244BDL  
TOP-SIDE MARKING  
FBGA – GRD  
Reel of 1000  
Tube of 25  
VD244B  
FBGA – ZRD (Pb-free)  
SN74LVT16244BDLG4  
SN74LVT16244BDLR  
74LVT16244BDLRG4  
SN74LVT16244BDGGR  
74LVT16244BDGGRG4  
SN74LVT16244BDGVR  
74LVT16244BDGVRE4  
SN74LVT16244BGQLR  
SN74LVT16244BZQLR  
SNJ54LVT16244BWD  
SSOP – DL  
LVT16244B  
Reel of 1000  
Reel of 2000  
Reel of 2000  
–40°C to 85°C  
TSSOP – DGG  
TVSOP – DGV  
LVT16244B  
VD244B  
VFBGA – GQL  
Reel of 1000  
Tube  
VD244B  
VFBGA – ZQL (Pb-free)  
CFP – WD  
–55°C to 125°C  
SNJ54LVT16244BWD  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Widebus is a trademark of Texas Instruments.  
UNLESS OTHERWISE NOTED this document contains  
Copyright © 2000–2006, Texas Instruments Incorporated  
PRODUCTION DATA information current as of publication date.  
Products conform to specifications per the terms of Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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