SN74LVC2G157
SINGLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER
www.ti.com
SCES207I–APRIL 1999–REVISED JUNE 2005
FEATURES
DCT OR DCU PACKAGE
(TOP VIEW)
•
Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
A
B
Y
V
CC
1
2
3
4
8
7
6
5
•
•
•
•
•
•
Supports 5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Max tpd of 6 ns at 3.3 V
G
A/B
Y
GND
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
4
3
2
1
5
6
7
8
GND
Y
Y
A/B
G
•
•
•
•
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
B
A
Ioff Supports Partial-Power-Down Mode
Operation
V
CC
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
This single 2-line to 1-line data selector/multiplexer is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2G157 features a common strobe (G) input. When the strobe is high, Y is low and Y is high. When
the strobe is low, a single bit is selected from one of two sources and is routed to the outputs. The device
provides true and complementary data.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)
NanoStar™ – WCSP (DSBGA)
0.17-mm Small Bump – YEA
SN74LVC2G157YEAR
NanoFree™ – WCSP (DSBGA)
0.17-mm Small Bump – YZA (Pb-free)
SN74LVC2G157YZAR
_ _ _C3_
Reel of 3000
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
SN74LVC2G157YEPR
–40°C to 85°C
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SN74LVC2G157YZPR
SSOP – DCT
Reel of 3000
Reel of 3000
Reel of 250
SN74LVC2G157DCTR
SN74LVC2G157DCUR
SN74LVC2G157DCUT
C57_ _ _
C57_
VSSOP – DCU
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 1999–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.