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74LVC1G17GM-Q100 PDF预览

74LVC1G17GM-Q100

更新时间: 2024-09-17 11:11:43
品牌 Logo 应用领域
安世 - NEXPERIA 光电二极管逻辑集成电路触发器
页数 文件大小 规格书
14页 231K
描述
Single Schmitt trigger bufferProduction

74LVC1G17GM-Q100 技术参数

生命周期:Active包装说明:VSON, SOLCC6,.04,20
Reach Compliance Code:compliant风险等级:5.58
系列:LVC/LCX/ZJESD-30 代码:R-PDSO-N6
长度:1.45 mm逻辑集成电路类型:BUFFER
功能数量:1输入次数:1
端子数量:6最高工作温度:125 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:VSON封装等效代码:SOLCC6,.04,20
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, VERY THIN PROFILE
最大电源电流(ICC):0.004 mAProp。Delay @ Nom-Sup:14 ns
传播延迟(tpd):14 ns施密特触发器:YES
筛选级别:AEC-Q100座面最大高度:0.5 mm
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):1.65 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:AUTOMOTIVE
端子形式:NO LEAD端子节距:0.5 mm
端子位置:DUAL宽度:1 mm
Base Number Matches:1

74LVC1G17GM-Q100 数据手册

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74LVC1G17-Q100  
Single Schmitt trigger buffer  
Rev. 5 — 14 January 2022  
Product data sheet  
1. General description  
The 74LVC1G17-Q100 is a single buffer Schmitt-trigger. Inputs can be driven from either 3.3 V  
or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5  
V environments. This device is fully specified for partial power down applications using IOFF. The  
IOFF circuitry disables the output, preventing the potentially damaging backflow current through the  
device when it is powered down.  
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100  
(Grade 1) and is suitable for use in automotive applications.  
2. Features and benefits  
Automotive product qualification in accordance with AEC-Q100 (Grade 1)  
Specified from -40 °C to +85 °C and from -40 °C to +125 °C  
Wide supply voltage range from 1.65 V to 5.5 V  
Overvoltage tolerant inputs to 5.5 V  
High noise immunity  
CMOS low power dissipation  
IOFF circuitry provides partial Power-down mode operation  
±24 mA output drive (VCC = 3.0 V)  
Latch-up performance exceeds 250 mA  
Direct interface with TTL levels  
Unlimited rise and fall times  
Complies with JEDEC standard:  
JESD8-7 (1.65 V to 1.95 V)  
JESD8-5 (2.3 V to 2.7 V)  
JESD8C (2.7 V to 3.6 V)  
JESD36 (4.5 V to 5.5 V)  
ESD protection:  
MIL-STD-883, method 3015 exceeds 2000 V  
HBM JESD22-A114F exceeds 2000 V  
MM JESD22-A115-A exceeds 200 V (C = 200 pf, R = 0 Ω)  
Multiple package options  
3. Ordering information  
Table 1. Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74LVC1G17GW-Q100  
-40 °C to +125 °C  
TSSOP5 plastic thin shrink small outline package; 5 leads; SOT353-1  
body width 1.25 mm  
74LVC1G17GV-Q100  
74LVC1G17GM-Q100  
-40 °C to +125 °C  
-40 °C to +125 °C  
SC-74A  
XSON6  
plastic surface-mounted package; 5 leads  
SOT753  
SOT886  
plastic extremely thin small outline package;  
no leads; 6 terminals; body 1 × 1.45 × 0.5 mm  
 
 
 

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Buffer, LVC/LCX/Z Series, 1-Func, 1-Input, CMOS, PDSO5