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74LCX16374MEA PDF预览

74LCX16374MEA

更新时间: 2024-11-03 22:45:59
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 总线驱动器总线收发器触发器逻辑集成电路光电二极管输出元件输入元件
页数 文件大小 规格书
10页 130K
描述
Low Voltage 16-Bit D-Type Flip-Flop with 5V Tolerant Inputs and Outputs

74LCX16374MEA 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SSOP
包装说明:0.300 INCH, MO-118, SSOP-48针数:48
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.15
Is Samacsys:N系列:LVC/LCX/Z
JESD-30 代码:R-PDSO-G48JESD-609代码:e3
长度:15.875 mm负载电容(CL):50 pF
逻辑集成电路类型:BUS DRIVER最大频率@ Nom-Sup:170000000 Hz
最大I(ol):0.024 A湿度敏感等级:1
位数:8功能数量:2
端口数量:2端子数量:48
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:SSOP
封装等效代码:SSOP48,.4封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, SHRINK PITCH包装方法:RAIL
峰值回流温度(摄氏度):260电源:3.3 V
Prop。Delay @ Nom-Sup:6.2 ns传播延迟(tpd):7.4 ns
认证状态:Not Qualified座面最大高度:2.74 mm
子类别:FF/Latches最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:0.635 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
触发器类型:POSITIVE EDGE宽度:7.495 mm
Base Number Matches:1

74LCX16374MEA 数据手册

 浏览型号74LCX16374MEA的Datasheet PDF文件第2页浏览型号74LCX16374MEA的Datasheet PDF文件第3页浏览型号74LCX16374MEA的Datasheet PDF文件第4页浏览型号74LCX16374MEA的Datasheet PDF文件第5页浏览型号74LCX16374MEA的Datasheet PDF文件第6页浏览型号74LCX16374MEA的Datasheet PDF文件第7页 
February 1994  
Revised May 2005  
74LCX16374  
Low Voltage 16-Bit D-Type Flip-Flop  
with 5V Tolerant Inputs and Outputs  
General Description  
Features  
5V tolerant inputs and outputs  
The LCX16374 contains sixteen non-inverting D-type  
flip-flops with 3-STATE outputs and is intended for bus ori-  
ented applications. The device is byte controlled. A buff-  
ered clock (CP) and Output Enable (OE) are common to  
each byte and can be shorted together for full 16-bit opera-  
tion.  
2.3V–3.6V VCC specifications provided  
6.2 ns tPD max (VCC 3.3V), 20 A ICC max  
Power down high impedance inputs and outputs  
Supports live insertion/withdrawal (Note 1)  
The LCX16374 is designed for low voltage (2.5V or 3.3V)  
24 mA output drive (VCC 3.0V)  
VCC applications with capability of interfacing to a 5V signal  
Uses patented noise/EMI reduction circuitry  
Latch-up performance exceeds 500 mA  
ESD performance:  
environment.  
The LCX16374 is fabricated with an advanced CMOS tech-  
nology to achieve high speed operation while maintaining  
CMOS low power dissipation.  
Human body model 2000V  
Machine model 200V  
Also packaged in plastic Fine-Pitch Ball Grid Array  
(FBGA)  
Note 1: To ensure the high-impedance state during power up or down, OE  
should be tied to V  
through a pull-up resistor: the minimum value or the  
CC  
resistor is determined by the current-sourcing capability of the driver.  
Ordering Code:  
Order Number Package Number  
Package Description  
74LCX16374G  
(Note 2)(Note 3)  
BGA54A  
MS48A  
MTD48  
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide  
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide  
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide  
74LCX16374MEA  
(Note 3)  
74LCX16374MTD  
(Note 3)  
Note 2: Ordering code Gindicates Trays.  
Note 3: Devices also available in Tape and Reel. Specify by appending the suffix letter Xto the ordering code.  
Logic Symbol  
© 2005 Fairchild Semiconductor Corporation  
DS012003  
www.fairchildsemi.com  

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