生命周期: | Transferred | 零件包装代码: | QFP |
包装说明: | QFP, | 针数: | 68 |
Reach Compliance Code: | unknown | ECCN代码: | 3A001.A.2.C |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.24 |
Is Samacsys: | N | 最长访问时间: | 25 ns |
JESD-30 代码: | S-CQFP-G68 | JESD-609代码: | e0 |
长度: | 22.352 mm | 内存密度: | 16777216 bit |
内存集成电路类型: | SRAM MODULE | 内存宽度: | 32 |
功能数量: | 1 | 端子数量: | 68 |
字数: | 524288 words | 字数代码: | 512000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 组织: | 512KX32 |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | QFP |
封装形状: | SQUARE | 封装形式: | FLATPACK |
并行/串行: | PARALLEL | 认证状态: | Not Qualified |
座面最大高度: | 5.08 mm | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | MILITARY | 端子面层: | TIN LEAD |
端子形式: | GULL WING | 端子节距: | 1.27 mm |
端子位置: | QUAD | 宽度: | 22.352 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
5962-9461108HMC | MICROSEMI |
获取价格 |
Cache SRAM Module, 512KX32, 25ns, CMOS, CQFP68, QFP-68 | |
5962-9461108HTA | MICROSEMI |
获取价格 |
SRAM Module, 512KX32, 25ns, CMOS, CPGA66, PGA-66 | |
5962-9461108HTC | MICROSEMI |
获取价格 |
Cache SRAM Module, 512KX32, 25ns, CMOS, CPGA66, PGA-66 | |
5962-9461108HTX | MICROSEMI |
获取价格 |
SRAM Module, 512KX32, 25ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HI | |
5962-9461108HXA | WEDC |
获取价格 |
SRAM Module, 2MX8, 25ns, CMOS, CPGA66, HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66 | |
5962-9461108HXC | WEDC |
获取价格 |
Cache SRAM Module, 512KX32, 25ns, CMOS, CPGA66, HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS | |
5962-9461108HXX | WEDC |
获取价格 |
IC 2M X 8 MULTI DEVICE SRAM MODULE, 25 ns, CHMA66, Static RAM | |
5962-9461108HYA | ETC |
获取价格 |
x32 SRAM Module | |
5962-9461108HYC | ETC |
获取价格 |
x32 SRAM Module | |
5962-9461109H_X | WEDC |
获取价格 |
SRAM Module, 512KX32, 20ns, CMOS, CQMA68, CERAMIC, QFP-68 |