生命周期: | Transferred | 零件包装代码: | PGA |
包装说明: | PGA, | 针数: | 66 |
Reach Compliance Code: | unknown | ECCN代码: | 3A001.A.2.C |
HTS代码: | 8542.32.00.41 | 风险等级: | 5.24 |
最长访问时间: | 25 ns | JESD-30 代码: | S-CPGA-P66 |
JESD-609代码: | e0 | 长度: | 27.305 mm |
内存密度: | 16777216 bit | 内存集成电路类型: | SRAM MODULE |
内存宽度: | 32 | 功能数量: | 1 |
端子数量: | 66 | 字数: | 524288 words |
字数代码: | 512000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
组织: | 512KX32 | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | PGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 并行/串行: | PARALLEL |
认证状态: | Not Qualified | 座面最大高度: | 4.5974 mm |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.5 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | TIN LEAD | 端子形式: | PIN/PEG |
端子节距: | 2.54 mm | 端子位置: | PERPENDICULAR |
宽度: | 27.305 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
5962-9461108HTC | MICROSEMI |
获取价格 |
Cache SRAM Module, 512KX32, 25ns, CMOS, CPGA66, PGA-66 | |
5962-9461108HTX | MICROSEMI |
获取价格 |
SRAM Module, 512KX32, 25ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HI | |
5962-9461108HXA | WEDC |
获取价格 |
SRAM Module, 2MX8, 25ns, CMOS, CPGA66, HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS-66 | |
5962-9461108HXC | WEDC |
获取价格 |
Cache SRAM Module, 512KX32, 25ns, CMOS, CPGA66, HEX-IN-LINE, SINGLE CAVITY, WITH STANDOFFS | |
5962-9461108HXX | WEDC |
获取价格 |
IC 2M X 8 MULTI DEVICE SRAM MODULE, 25 ns, CHMA66, Static RAM | |
5962-9461108HYA | ETC |
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x32 SRAM Module | |
5962-9461108HYC | ETC |
获取价格 |
x32 SRAM Module | |
5962-9461109H_X | WEDC |
获取价格 |
SRAM Module, 512KX32, 20ns, CMOS, CQMA68, CERAMIC, QFP-68 | |
5962-9461109H9A | WEDC |
获取价格 |
SRAM Module, 512KX32, 20ns, CMOS, CQMA68, CERAMIC, QFP-68 | |
5962-9461109H9C | WEDC |
获取价格 |
Cache SRAM Module, 512KX32, 20ns, CMOS, CQFP68, CERAMIC, QFP-68 |