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54LVTH244ARPFS PDF预览

54LVTH244ARPFS

更新时间: 2024-10-01 22:36:43
品牌 Logo 应用领域
麦斯威 - MAXWELL 总线驱动器总线收发器逻辑集成电路信息通信管理
页数 文件大小 规格书
9页 195K
描述
3.3V ABT 8-Bit Octal Buffers/Drivers

54LVTH244ARPFS 技术参数

生命周期:Transferred零件包装代码:DFP
包装说明:DFP, FL20,.3针数:20
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.29控制类型:ENABLE LOW
系列:LVTJESD-30 代码:R-XDFP-F20
长度:12.192 mm逻辑集成电路类型:BUS DRIVER
最大I(ol):0.032 A位数:4
功能数量:2端口数量:2
端子数量:20最高工作温度:125 °C
最低工作温度:-55 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:UNSPECIFIED
封装代码:DFP封装等效代码:FL20,.3
封装形状:RECTANGULAR封装形式:FLATPACK
电源:3.3 VProp。Delay @ Nom-Sup:4.7 ns
传播延迟(tpd):4.7 ns认证状态:Not Qualified
筛选级别:38535V;38534K;883S座面最大高度:3.9116 mm
子类别:Bus Driver/Transceivers最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:BICMOS
温度等级:MILITARY端子形式:FLAT
端子节距:1.27 mm端子位置:DUAL
总剂量:100k Rad(Si) V宽度:7.493 mm
Base Number Matches:1

54LVTH244ARPFS 数据手册

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54LVTH244A  
3.3V ABT 8-Bit Octal  
Buffers/Drivers  
Logic Diagram  
FEATURES:  
DESCRIPTION:  
3.3V ABT octal buffers/drivers with 3-state outputs  
RAD-PAK® radiation-hardened against natural space radia-  
tion  
Maxwell Technologies’ 54LVTH244A octal buffers/drivers  
micro-circuit is housed in a Rad-Pak® package. The  
54LVTH244A is designed specifically for low voltage (3.3V)  
Package:  
VCC operation, but with the capability to provide a TTL inter-  
- 20 Pin RAD-PAK® flat package  
Operating temperature range:  
face to a 5V system environment. The 54LVTH244A is orga-  
nized as two 4-bit drivers with separate output enable (OE)  
inputs. When OE is low, the device passes data from the A  
inputs to the Y outputs. When OE is high, the outputs are in  
the high impedance state. The 54LVTH244A active bus hold  
circuitry is provided to prevent floating data inputs at a valid  
logic level and to eliminate the need for pullup resistors.  
-55 to 125°C  
Supports mixed-mode signal operation  
-5V Input and Output Voltages with 3.3V VCC  
Supports mixed-mode signal operation  
- 5V input and output voltages with 3.3V VCC  
Supports unregulated battery operation down to 2.7V  
Typical VOLP (output ground bounce) < 0.8V at VCC=3.3V,  
TA=25°C  
Maxwell Technologies' patented RAD-PAK® packaging technol-  
ogy incorporates radiation shielding in the microcircuit pack-  
age. It eliminates the need for box shielding while providing  
the required radiation shielding for a lifetime in orbit or a space  
mission. This product is available with packaging and screen-  
ing up to Class S.  
Supports live insertion  
Bus-hold data inputs eliminate the need for external pullup  
resistors  
1000601  
12.19.01 Rev 1  
1
All data sheets are subject to change without notice  
(858) 503-3300 - Fax: (858) 503-3301 - www.maxwell.com  
©2001 Maxwell Technologies  
All rights reserved.  

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