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3N163 PDF预览

3N163

更新时间: 2024-10-31 21:53:23
品牌 Logo 应用领域
CALOGIC 晶体开关放大器晶体管
页数 文件大小 规格书
2页 32K
描述
P-Channel Enhancement Mode MOSFET General Purpose Amplifier Switch

3N163 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TO-72
包装说明:CYLINDRICAL, O-MBCY-W4针数:4
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.21.00.95风险等级:5.35
Is Samacsys:N其他特性:VERY HIGH INPUT IMPEDANCE
配置:SINGLE最小漏源击穿电压:40 V
最大漏极电流 (Abs) (ID):0.05 A最大漏极电流 (ID):0.05 A
最大漏源导通电阻:250 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss):0.7 pFJEDEC-95代码:TO-72
JESD-30 代码:O-MBCY-W4元件数量:1
端子数量:4工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:METAL
封装形状:ROUND封装形式:CYLINDRICAL
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):0.375 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:NO
端子形式:WIRE端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

3N163 数据手册

 浏览型号3N163的Datasheet PDF文件第2页 
P-Channel Enhancement Mode  
MOSFET General Purpose  
Amplifier Switch  
CORPORATION  
3N163 / 3N164  
FEATURES  
ABSOLUTE MAXIMUM RATINGS (Note 1)  
(TA = 25oC unless otherwise specified)  
Very High Input Impedance  
High Gate Breakdown  
Fast Switching  
Drain-Source or Drain-Gate Voltage  
3N163. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40V  
3N164. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -30V  
Static Gate-Source Voltage  
Low Capacitance  
3N163. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±40V  
3N164. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V  
Transient Gate-Source Voltage (Note 2) . . . . . . . . . . . . ±125V  
Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA  
Storage Temperature. . . . . . . . . . . . . . . . . . . -65oC to +200oC  
Operating Temperature . . . . . . . . . . . . . . . . . -55oC to +150oC  
Lead Temperature (Soldering, 10sec) . . . . . . . . . . . . . +300oC  
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 375mW  
Derate above +25oC . . . . . . . . . . . . . . . . . . . . . . 3.0mW/oC  
PIN CONFIGURATION  
TO-72  
NOTE: Stresses above those listed under "Absolute Maximum  
Ratings" may cause permanent damage to the device. These are  
stress ratings only and functional operation of the device at these or  
any other conditions above those indicated in the operational sections  
of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
S
C
D
G
ORDERING INFORMATION  
1503  
Part  
Package  
Temperature Range  
3N163-64  
X3N163-64 Sorted Chips in Carriers  
Hermetic TO-72  
-55oC to +150oC  
-55oC to +150oC  
ELECTRICAL CHARACTERISTICS (TA = 25oC unless otherwise specified)  
3N163  
3N164  
SYMBOL  
PARAMETER  
UNITS  
TEST CONDITIONS  
MIN MAX MIN MAX  
VGS = -40V, VDS = 0 (3N163)  
GS = -30V, VDS = 0 (3N164)  
-10  
-25  
-10  
-25  
V
IGSS  
Gate-Body Leakage Current  
pA  
TA = +125oC  
BVDSS  
BVSDS  
VGS(th)  
VGS(th)  
VGS  
Drain-Source Breakdown Voltage  
Source-Drain Breakdown Voltage  
Threshold Voltage  
-40  
-40  
-30  
-30  
ID = -10µA, VGS = 0  
IS = -10µA, VGD = 0, VBD = 0  
VDS = VGS, ID = -10µA  
VDS = -15V, ID = -10µA  
VDS = -15V, ID = -0.5mA  
VDS = -15V, VGS = 0  
V
-2.0 -5.0 -2.0 -5.0  
-2.0 -5.0 -2.0 -5.0  
-2.5 -6.5 -2.5 -6.5  
Threshold Voltage  
Gate Source Voltage  
IDSS  
Zero Gate Voltage Drain Current  
Source Drain Current  
200  
400  
250  
400  
800  
pA  
ISDS  
VSD = 15V, VGS = VDB = 0  
VGS = -20V, ID = -100µA  
VDS = +15V, VGS = -10V  
rDS(on)  
ID(on)  
Drain-Source on Resistance  
On Drain Current  
300 ohms  
mA  
-5.0 -30.0 -3.0 -30.0  

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