3N165, 3N166
MONOLITHIC DUAL P-CHANNEL
ENHANCEMENT MODE MOSFET
Linear Integrated Systems
FEATURES
VERY HIGH INPUT IMPEDANCE
HIGH GATE BREAKDOWN
ULTRA LOW LEAKAGE
LOW CAPACITANCE
ABSOLUTE MAXIMUM RATINGS (NOTE 1)
(TA= 25°C unless otherwise noted)
1
7
C
S
Drain-Source or Drain-Gate Voltage (NOTE 2)
3N165
3N166
Transient G-S Voltage (NOTE 3)
Gate-Gate Voltage
Drain Current (NOTE 2)
G1
D1
G2
D2
40 V
30 V
±125 V
±80 V
50 mA
5
3
4
8
Storage Temperature
Operating Temperature
Lead Temperature (Soldering, 10 sec.)
Power Dissipation (One Side)
Total Derating above 25°C
-65°C to +200°C
-55°C to +150°C
+300°C
300 mW
4.2 mW/°C
TO-99
Bottom View
Device Schematic
ELECTRICAL CHARACTERISTICS (TA=25°C and VBS=0 unless otherwise specified)
LIMITS
SYMBOL
IGSSR
CHARACTERISTICS
Gate Reverse Leakage Current
Gate Forward Leakage Current
MIN. MAX.
UNITS
CONDITIONS
--
--
10
-10
-25
-200
-400
-30
-5
VGS= 40 V
VGS= -40 V
TA=+125°C
VDS= -20 V
VSD= -20 V
VDS= -15 V
VDS= -15 V
VDS= VGS
IGSSF
--
pA
IDSS
Drain to Source Leakage Current
Source to Drain Leakage Current
On Drain Current
--
ISDS
--
VDB= 0
ID(on)
VGS(th)
VGS(th)
rDS(on)
gfs
-5
-2
-2
--
mA
V
VGS= -10 V
ID= -10 µA
ID= -10 µA
ID= -100 µA
ID= -10mA
Gate Source Threshold Voltage
Gate Source Threshold Voltage
Drain Source ON Resistance
Forward Transconductance
Output Admittance
-5
V
300
3000
300
3.0
0.7
3.0
--
ohms
µs
VGS= -20 V
VDS= -15V
1500
--
f=1kHz
gos
µs
Ciss
Input Capacitance
--
Crss
Reverse Transfer Capacitance
Output Capacitance
--
pF
VDS= -15V
(NOTE 4)
VDS= -15V
(NOTE 4)
ID= -10mA
ID= -10mA
f=1MHz
Coss
RE(Yfs)
--
Common Source Forward Transconductance 1200
µs
f=100MHz
Linear Integrated Systems 4042 Clipper Ct., Fremont, CA 94538 TEL: (510) 490-9160 • FAX: (510) 353-0261