LS/3N165, LS/3N166
MONOLITHIC DUAL P-CHANNEL
ENHANCEMENT MODE MOSFET
FEATURES
VERY HIGH INPUT IMPEDANCE
HIGH GATE BREAKDOWN
ULTRA LOW LEAKAGE
LOW CAPACITANCE
LS3N165, LS3N166
3N165, 3N166
ABSOLUTE MAXIMUM RATINGS (NOTE 1)
(TA=25°C unless otherwise noted)
Drain-Source or Drain-Gate Voltage (NOTE 2)
3N165
40 V
3N166
30 V
Gate-Gate Voltage
±80 V
Drain Current (NOTE 2)
Storage Temperature
50 mA
TO-99
TOP VIEW
SOIC
TOP VIEW
-55ºC to +150ºC
-55ºC to +150ºC
+300ºC
Operating Temperature
Lead Temperature (Soldering, 10 sec.)
Power Dissipation (One Side)
Total Derating above 25ºC
300 mW
4.2 mW/ºC
ELECTRICAL CHARACTERISTICS (TA=25°C and VBS=0 unless otherwise noted)
3N165 &
3N166
LS3N165 &
LS3N166
SYMBOL
IGSSR
CHARACTERISTIC
Gate Reverse Leakage Current
Gate Forward Leakage Current
MIN MAX MIN MAX UNITS
CONDITIONS
--
--
10
-10
-25
-200
-400
-30
-5
--
--
--
100
-100
--
VGS=40V
IGSSF
VGS=-40V
TA=+125ºC
--
pA
IDSS
Drain to Source Leakage Current
Source to Drain Leakage Current
On Drain Current
--
-200
-400
-30
-5
VDS=-20 V, VGS=VBS=0V
ISDS
--
--
-5
-2
-2
--
VSD=-20 V, VGD=VDB=0V
ID(on)
VGS(th)
VGS(th)
rDS(on)
gfs
-5
-2
-2
--
mA
V
VDS=-15V VGS=-10 V VSB=0V
Gate Source Threshold Voltage
Gate Source Threshold Voltage
Drain Source ON Resistance
Forward Transconductance
Output Admittance
VDS=-15V ID=-10µA
VDS=VGS ID=-10µA
VSB=0V
VSB=0V
-5
-5
V
300
300 ohms VGS=-20V ID=-100µA VSB=0V
1500 3000 1500 3000 µS
VDS=-15V ID=-10mA
VSB=0V
f=1kHz
gos
--
--
300
3.0
0.7
3.0
--
--
--
--
--
300
3.0
1.0
3.0
µS
pF
µS
Clss
Input Capacitance
Crss
Reverse Transfer Capacitance
Output Capacitance
--
VDS=-15V ID=-10mA
(NOTE 3) VSB=0V
VDS=-15V ID=-10mA
(NOTE 3) VSB=0V
f=1MHz
Coss
RE(Yls)
--
1200
f=100MHz
Common Source Forward
Transconductance
Linear Integrated Systems
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Doc 201138 06/26/2013 Rev#A6 ECN# 3N165 3N166