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2SA1360Y PDF预览

2SA1360Y

更新时间: 2024-11-22 12:54:31
品牌 Logo 应用领域
东芝 - TOSHIBA 晶体音频放大器晶体管功率双极晶体管局域网
页数 文件大小 规格书
5页 156K
描述
Audio Frequency Amplifier Applications

2SA1360Y 技术参数

生命周期:Obsolete针数:3
Reach Compliance Code:unknown风险等级:5.75
Is Samacsys:N最大集电极电流 (IC):0.05 A
集电极-发射极最大电压:150 V配置:SINGLE
最小直流电流增益 (hFE):120JESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
极性/信道类型:PNP最大功率耗散 (Abs):1.2 W
子类别:Other Transistors表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
标称过渡频率 (fT):200 MHzBase Number Matches:1

2SA1360Y 数据手册

 浏览型号2SA1360Y的Datasheet PDF文件第2页浏览型号2SA1360Y的Datasheet PDF文件第3页浏览型号2SA1360Y的Datasheet PDF文件第4页浏览型号2SA1360Y的Datasheet PDF文件第5页 
2SA1360  
TOSHIBA Transistor Silicon PNP Epitaxial Type (PCT Process)  
2SA1360  
Audio Frequency Amplifier Applications  
Unit: mm  
Complementary to 2SC3423  
Small collector output capacitance: C = 2.5 pF (typ.)  
ob  
High transition frequency: f = 200 MHz (typ.)  
T
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Collector-base voltage  
Symbol  
Rating  
Unit  
V
CBO  
V
CEO  
V
EBO  
150  
150  
5  
V
V
Collector-emitter voltage  
Emitter-base voltage  
Collector current  
V
I
50  
mA  
mA  
C
Base current  
I
5  
B
Ta = 25°C  
Tc = 25°C  
1.2  
Collector power  
dissipation  
P
W
C
5
JEDEC  
JEITA  
Junction temperature  
T
150  
°C  
°C  
j
Storage temperature range  
T
stg  
55 to 150  
TOSHIBA  
2-8H1A  
Note1: Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in  
Weight: 0.82 g (typ.)  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are  
within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
1
2010-03-10  

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