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1N5811D3B PDF预览

1N5811D3B

更新时间： 2024-01-29 04:28:24
品牌 Logo 应用领域
SEME-LAB 超快速恢复能力电源超快恢复二极管快速恢复二极管
页数 文件大小 规格书
4页 293K
描述
ULTRA FAST RECOVERY POWER RECTIFIER

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中文翻译

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1N5811D3B 技术参数

生命周期：Active包装说明：R-CDSO-N2
针数：2Reach Compliance Code：unknown
ECCN代码：EAR99HTS代码：8541.10.00.80
风险等级：5.59其他特性：HIGH RELIABILITY
应用：ULTRA FAST RECOVERY POWER配置：SINGLE
二极管元件材料：SILICON二极管类型：RECTIFIER DIODE
JESD-30 代码：R-CDSO-N2JESD-609代码：e4
最大非重复峰值正向电流：125 A元件数量：1
相数：1端子数量：2
最高工作温度：175 °C最低工作温度：-65 °C
最大输出电流：3 A封装主体材料：CERAMIC, METAL-SEALED COFIRED
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
认证状态：Not Qualified最大重复峰值反向电压：150 V
最大反向恢复时间：0.05 µs表面贴装：YES
端子面层：GOLD端子形式：NO LEAD
端子位置：DUALBase Number Matches：1

1N5811D3B 数据手册

 浏览型号1N5811D3B的Datasheet PDF文件第2页浏览型号1N5811D3B的Datasheet PDF文件第3页浏览型号1N5811D3B的Datasheet PDF文件第4页 
ULTRA FAST RECOVERY  
POWER RECTIFIER  
1N5811D3A / 1N5811D3B  
•
DLCC3 - Light Weight Hermetic Ceramic Surface Mount  
Package is designed as a drop In replacement for “D-5B” / “E-  
MELF” package†  
•
•
•
Ultra Fast Reverse Recovery  
Switching Power Supply Applications  
Space Level and High-Reliability Screening Options Available  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
A
V
V
I
Breakdown Voltage  
160V  
BR  
Working Peak Reverse Voltage  
Maximum Rectified Current I 1 = T +55°C  
150V  
RWM  
(1)  
A
Derate above T 55°C  
3.0A  
O
o
25mA/°C  
125A  
A
(2)  
I
Surge Current, t = 8.3ms  
p
FSM  
T
Junction Temperature Range  
Storage Temperature Range  
-65 to +175°C  
-65 to +175°C  
J
T
stg  
THERMAL PROPERTIES  
Symbols  
Parameters  
Max.  
Units  
°C/W  
°C/W  
°C/W  
Thermal Resistance, Junction To Solder Pads T = 25°C  
SP  
R
17  
50  
θJSP(IN)  
(3)  
(4)  
R
Thermal Resistance, Junction To Ambient, On PCB  
Thermal Resistance, Junction To Ambient, On PCB  
θJA(PCB)  
R
117  
θJA(PCB)  
Notes  
(1) I  
is rated at 3.0A @ T = 55°C for PC boards where thermal resistance from mounting point to ambient is sufficiently controlled where  
O1  
A
T
does not exceed 175°C; This equates to R  
θJA(PCB)  
≤ 52°C/W.  
J(Max)  
(2) T = 25°C @ I =3.0A and V for ten 8.3mS surges at 1 minute intervals.  
RWM  
A
O
(3) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0” x 1.0”), (645mm x 645mm) , horizontal in still air.  
(4) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.070” x 0.155”)‡, (1.78mm x 3.94mm) ‡, horizontal in still air.  
is rated at 1.5A @ T = 55°C for PC boards where R ≤ 120°C/W. Derate at 12.5mA/°C above T = 55°C in this case.  
θJA(PCB) A  
I
O1  
A
‡ Recommended solder pad layout dimensions for this device, as detailed within this datasheet for the D-5B device.  
Semelab plc reserves the right to change test conditions, parameter limits and package dimensions without notice.  
Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However  
Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to  
verify that datasheets are current before placing an order.  
Semelab plc  
Telephone +44 (0) 1455 556565  
Email: sales@semelab-tt.com  
Coventry Road, Lutterworth, Leicestershire, LE17 4JB  
Fax +44 (0) 1455 552612  
Website: http://www.semelab-tt.com  
Document Number 8613  
Issue 2  
Page 1 of 4  
1234

中文翻译

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