YJD60G10A
■ TO-252-B Package information
A2
A3
D
D1
DIMENSIONS
INCHES
Millimeter
SYMBOL
MIN.
MIN.
NOM.
---
MAX.
0.008
NOM.
---
MAX.
0.200
2.400
1.100
A1
A2
A3
b
0.000
2.200
0.900
0.000
0.087
0.035
A1
0.091
0.039
0.094
0.043
2.300
1.000
0.760
0.030
0.020
0.260
0.209
0.189
0.398
0.240
0.209
0.034
0.023
0.264
0.215
0.195
0.406
0.244
0.215
0.026
0.018
0.256
0.203
0.181
0.390
0.236
0.203
0.660
0.860
0.580
6.700
5.450
4.950
10.300
6.200
5.450
θ
c
0.520
6.600
5.300
4.800
10.100
6.100
5.300
0.460
6.500
D
0.51
D1
5.150
D2
E
4.600
9.900
6.000
5.150
C
b
e
E1
E2
e
TOP VIEW
SIDE VIEW
6.740
0.090BSC
0.059
---
2.286BSC
D2
0.069
0.050
0.075
0.039
0.049
0.035
0.055
0.024
L
1.250
0.900
1.500
---
1.750
1.270
L1
---
L2
L3
L4
θ
---
1.400
0.600
1.900
1.000
0.800
0.031
0.114REF
---
2.900REF
10°
10°
0°
0°
---
NOTE:
1.520
1.PACKAGE BODY SIZES EXCLUDE MOLD FLASH
AND GATE BURRS.
2.TOLERANCE 0.1mm UNLESS OTHERWISE
SPECIFIED.
3.THE PAD LAYOUT IS FOR REFERENCE
PURPOSES ONLY.
4.560
UNIT:mm
BOTTOM VIEW
SUGGESTED SOLDER PAD LAYOUT
7 / 8
S-E358
Rev.1.0,13-Jun-23
Yangzhou Yangjie Electronic Technology Co., Ltd.
www.21yangjie.com