APPLICATION NOTE
0
R
XCR3320: 320 Macrocell SRAM
CPLD
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14*
DS033 (v1.1) February 10, 2000
Product Specification
nique is also what allows Xilinx to offer a true CPLD archi-
tecture in a high density device.
Features
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•
•
320 macrocell SRAM based CPLD
Configuration times of under 1.0 second
IEEE 1149.1 compliant JTAG testing capability
The Xilinx XCR3320 devices use the patented XPLA2
(eXtended Programmable Logic Array) architecture. This
architecture combines the best features of both PAL- and
PLA-type logic structures to deliver high speed and flexible
logic allocation that results in superior ability to make
design changes with fixed pinouts. The XPLA2 architecture
is constructed from 80 macrocell Fast Modules that are
connected together by an interconnect array. Within each
Fast Module are four Logic Blocks of 20 macrocells each.
Each Logic Block contains a PAL structure with four dedi-
cated product terms for each macrocell. In addition, each
Logic Block has 32 additional product terms in a PLA struc-
ture that can be shared through a fully programmable OR
array to any of the 20 macrocells. This combination effi-
ciently allocates logic throughout the Logic Block, which
increases device density and allows for design changes
without re-defining the pinout or changing the system tim-
ing. The XCR3320 offers pin-to-pin propagation delays of
7.5 ns through the PAL array of a Fast Module; and if the
PLA array is used, an additional 1.5 ns is added to the
delay, no matter how many PLA product terms are used. If
the interconnect array between Fast Modules is used, there
is a second fixed delay of 2.0 ns. This means that the worst
case pin-to-pin propagation delay within a fast module is
7.5 + 1.5 = 9.0 ns, and the delay from any pin to any other
pin across the entire chip is 7.5 + 2.0 = 9.5 ns if only the
PAL array is used, and 7.5 + 1.5 + 2.0 = 11.0 ns if the PLA
array is used.
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Five pin JTAG interface
IEEE 1149.1 TAP controller
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•
•
In system configurable
3.3V device with 5V tolerant I/O
Innovative XPLA2 Architecture combines extreme
flexibility and high speeds
•
•
•
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Eight synchronous clock networks with programmable
polarity at every macrocell
Up to 32 asynchronous clocks support complex
clocking needs
Innovative XOR structure at every macrocell provides
excellent logic reduction capability
Logic expandable to 36 product terms on a single
macrocell
•
•
Advanced 0.35µ SRAM process
Design entry and verification using industry standard
and Xilinx CAE tools
•
Control Term structure provides either sum terms or
product terms in each logic block for:
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3-state buffer control
Asynchronous macrocell register reset/preset
•
Global 3-state pin facilitates "bed of nails" testing
without sacrificing logic resources
Programmable slew rate control
Small form factor packages with high I/O counts
Available in commercial and industrial temperature
ranges
•
•
•
Each macrocell also has a two input XOR gate with the
dedicated PAL product terms on one input and the PLA
product terms on the other input. This patent-pending Ver-
satile XOR structure allows for very efficient logic optimiza-
tion compared to competing XOR structures that have only
one product term as the second input to the XOR gate. The
Versatile XOR allows an 8-bit XOR function to be imple-
mented in only 20 product terms, compared to 65 product
terms for the traditional XOR approach.
Description
The XCR3320 device is a member of the CoolRunner™
family of high-density SRAM-based CPLDs (Complex Pro-
grammable Logic Device) from Xilinx. This device com-
bines high speed and deterministic pin-to-pin timing with
high density. The XCR3320 uses the patented Fast Zero
Power (FZP™) design technique that combines high speed
and low power for the first time ever in a CPLD. FZP allows
the XCR3320 to have true pin-to-pin timing delays of 7.5 ns,
and standby currents of 100 µA without the need for `turbo
bits' or other power down schemes. By replacing conven-
tional sense amplifier methods for implementing product
terms (a technique that has been used since the bipolar
era) with a cascaded chain of pure CMOS gates, both
standby and dynamic power are dramatically reduced
when compared to other CPLDs. The FZP design tech-
The XCR3320 is SRAM-based, which means that it is con-
figured from an external source at power up. See the con-
figuration section of this data sheet for more information.
The device supports the full JTAG specification (IEEE
1149.1) through an industry standard JTAG interface. It can
also be configured through the JTAG port, which is very
useful for prototyping. See section titled “Device Configura-
tion Through JTAG” on page 29 for more information.
DS033 (v1.1) February 10, 2000
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