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XCR3320-8TQ160I PDF预览

XCR3320-8TQ160I

更新时间: 2024-11-13 21:12:39
品牌 Logo 应用领域
赛灵思 - XILINX 时钟可编程逻辑
页数 文件大小 规格书
43页 363K
描述
Loadable PLD, 8.5ns, 320-Cell, CMOS, PQFP160, PLASTIC, TQFP-160

XCR3320-8TQ160I 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:QFP, QFP160,1.0SQ,20
针数:160Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.92
其他特性:YES最大时钟频率:95 MHz
系统内可编程:YESJESD-30 代码:S-PQFP-G160
JTAG BST:YES湿度敏感等级:1
宏单元数:320端子数量:160
最高工作温度:85 °C最低工作温度:-40 °C
输出函数:MACROCELL封装主体材料:PLASTIC/EPOXY
封装代码:QFP封装等效代码:QFP160,1.0SQ,20
封装形状:SQUARE封装形式:FLATPACK
峰值回流温度(摄氏度):225电源:3.3 V
可编程逻辑类型:LOADABLE PLD传播延迟:8.5 ns
认证状态:Not Qualified子类别:Programmable Logic Devices
最大供电电压:3.6 V最小供电电压:3 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

XCR3320-8TQ160I 数据手册

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APPLICATION NOTE  
This product has been discontinued. Please see www.xilinx.com/partinfo/notify/pdn0007.htm for details.  
0
R
XCR3320: 320 Macrocell SRAM  
CPLD  
0
DS033 (v1.3) October 9, 2000  
0* Product Specification  
nique is also what allows Xilinx to offer a true CPLD archi-  
tecture in a high density device.  
Features  
320 macrocell SRAM based CPLD  
Configuration times of under 1.0 second  
IEEE 1149.1 compliant JTAG testing capability  
The Xilinx XCR3320 devices use the patented XPLA2  
(eXtended Programmable Logic Array) architecture. This  
architecture combines the best features of both PAL- and  
PLA-type logic structures to deliver high speed and flexible  
logic allocation that results in superior ability to make  
design changes with fixed pinouts. The XPLA2 architecture  
is constructed from 80 macrocell Fast Modules that are  
connected together by an interconnect array. Within each  
Fast Module are four Logic Blocks of 20 macrocells each.  
Each Logic Block contains a PAL structure with four dedi-  
cated product terms for each macrocell. In addition, each  
Logic Block has 32 additional product terms in a PLA struc-  
ture that can be shared through a fully programmable OR  
array to any of the 20 macrocells. This combination effi-  
ciently allocates logic throughout the Logic Block, which  
increases device density and allows for design changes  
without re-defining the pinout or changing the system tim-  
ing. The XCR3320 offers pin-to-pin propagation delays of  
7.5 ns through the PAL array of a Fast Module; and if the  
PLA array is used, an additional 1.5 ns is added to the  
delay, no matter how many PLA product terms are used. If  
the interconnect array between Fast Modules is used, there  
is a second fixed delay of 2.0 ns. This means that the worst  
case pin-to-pin propagation delay within a fast module is  
7.5 + 1.5 = 9.0 ns, and the delay from any pin to any other  
pin across the entire chip is 7.5 + 2.0 = 9.5 ns if only the  
PAL array is used, and 7.5 + 1.5 + 2.0 = 11.0 ns if the PLA  
array is used.  
-
-
Five pin JTAG interface  
IEEE 1149.1 TAP controller  
In system configurable  
3.3V device with 5V tolerant I/O  
Innovative XPLA2 Architecture combines extreme  
flexibility and high speeds  
Eight synchronous clock networks with programmable  
polarity at every macrocell  
Up to 32 asynchronous clocks support complex  
clocking needs  
Innovative XOR structure at every macrocell provides  
excellent logic reduction capability  
Logic expandable to 36 product terms on a single  
macrocell  
Advanced 0.35µ SRAM process  
Design entry and verification using industry standard  
and Xilinx CAE tools  
Control Term structure provides either sum terms or  
product terms in each logic block for:  
-
-
3-state buffer control  
Asynchronous macrocell register reset/preset  
Global 3-state pin facilitates "bed of nails" testing  
without sacrificing logic resources  
Programmable slew rate control  
Small form factor packages with high I/O counts  
Available in commercial and industrial temperature  
ranges  
Each macrocell also has a two input XOR gate with the  
dedicated PAL product terms on one input and the PLA  
product terms on the other input. This patent-pending Ver-  
satile XOR structure allows for very efficient logic optimiza-  
tion compared to competing XOR structures that have only  
one product term as the second input to the XOR gate. The  
Versatile XOR allows an 8-bit XOR function to be imple-  
mented in only 20 product terms, compared to 65 product  
terms for the traditional XOR approach.  
Description  
The XCR3320 device is a member of the CoolRunner®  
family of high-density SRAM-based CPLDs (Complex Pro-  
grammable Logic Device) from Xilinx. This device com-  
bines high speed and deterministic pin-to-pin timing with  
high density. The XCR3320 uses the patented Fast Zero  
Power (FZP) design technique that combines high speed  
and low power for the first time ever in a CPLD. FZP allows  
the XCR3320 to have true pin-to-pin timing delays of 7.5  
ns, and standby currents of 100 µA without the need for  
`turbo bits' or other power down schemes. By replacing  
conventional sense amplifier methods for implementing  
product terms (a technique that has been used since the  
bipolar era) with a cascaded chain of pure CMOS gates,  
both standby and dynamic power are dramatically reduced  
when compared to other CPLDs. The FZP design tech-  
The XCR3320 is SRAM-based, which means that it is con-  
figured from an external source at power up. See the con-  
figuration section of this data sheet for more information.  
The device supports the full JTAG specification (IEEE  
1149.1) through an industry standard JTAG interface. It can  
also be configured through the JTAG port, which is very  
useful for prototyping. See section titled Device Configura-  
tion Through JTAGon page 29 for more information.  
DS033 (v1.3) October 9, 2000  
www.xilinx.com  
1-800-255-7778  
1

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