是否Rohs认证: | 符合 | 生命周期: | Active |
零件包装代码: | DFN | 包装说明: | HVSON, |
针数: | 8 | Reach Compliance Code: | compliant |
HTS代码: | 8542.32.00.71 | 风险等级: | 5.25 |
JESD-30 代码: | S-PDSO-N8 | 长度: | 3 mm |
内存密度: | 16384 bit | 内存集成电路类型: | MEMORY CIRCUIT |
内存宽度: | 16 | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 8 |
字数: | 1024 words | 字数代码: | 1000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 组织: | 1KX16 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HVSON |
封装形状: | SQUARE | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 座面最大高度: | 0.6 mm |
最大供电电压 (Vsup): | 3 V | 最小供电电压 (Vsup): | 2.1 V |
标称供电电压 (Vsup): | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | NO LEAD | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 3 mm | Base Number Matches: | 1 |
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