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WF128K32N-60G2LC5A PDF预览

WF128K32N-60G2LC5A

更新时间： 2024-09-13 15:57:59
品牌 Logo 应用领域
美高森美 - MICROSEMI 内存集成电路
页数 文件大小 规格书
11页 814K
描述
Flash Module, CQFP68, 22.4 MM, CERAMIC, QFP-68

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WF128K32N-60G2LC5A 技术参数

生命周期：Obsolete零件包装代码：QFP
包装说明：,针数：68
Reach Compliance Code：unknown风险等级：5.63
Is Samacsys：NJESD-30 代码：S-CQFP-G68
内存集成电路类型：FLASH MODULE端子数量：68
封装主体材料：CERAMIC, METAL-SEALED COFIRED封装形状：SQUARE
封装形式：FLATPACK编程电压：5 V
认证状态：Not Qualified表面贴装：YES
端子形式：GULL WING端子位置：QUAD
Base Number Matches：1

WF128K32N-60G2LC5A 数据手册

 浏览型号WF128K32N-60G2LC5A的Datasheet PDF文件第2页浏览型号WF128K32N-60G2LC5A的Datasheet PDF文件第3页浏览型号WF128K32N-60G2LC5A的Datasheet PDF文件第4页浏览型号WF128K32N-60G2LC5A的Datasheet PDF文件第5页浏览型号WF128K32N-60G2LC5A的Datasheet PDF文件第6页浏览型号WF128K32N-60G2LC5A的Datasheet PDF文件第7页 
WF128K32-XXX5  
128KX32 5V NOR FLASH MODULE (SMD 5962-94716**)  
FEATURES  
 Access times of 50*, 60, 70, 90, 120, 150ns  
 Low power CMOS  
 Packaging:  
 Embedded erase and program algorithms  
 TTL compatible inputs and CMOS outputs  
• 66 pin, PGA type, 1.075 inch square, Hermetic Ceramic  
HIP (Package 400)  
 Built-in decoupling caps and multiple ground pins for low  
• 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880 inch)  
square, 3.56mm (0.140 inch) high (Package 510)  
noise operation  
 Page program operation and internal program control time  
 Weight  
• 68 lead, Hermetic CQFP (G2L), 22.4mm (0.880 inch)  
square, 4.06mm (0.160 inch) high (Package 528)  
WF128K32-XG2LX5 - 8 grams typical  
WF128K32-XG2UX5 - 8 grams typical  
WF128K32-XH1X5 - 13 grams typical  
 Sector architecture  
• 8 equal size sectors of 16KBytes each  
• Any combination of sectors can be concurrently erased.  
Also supports full chip erase  
This product is subject to change without notice.  
Note: For programming information and waveforms refer to Flash Programming 1M5 Application  
Note AN0036.  
 100,000 erase/program cycles minimum  
 Organized as 128Kx32  
* The access time of 50ns is available in Industrial and Commercial temperature ranges only.  
** For reference only. See SMD table on page 10.  
 Commercial, industrial and military temperature ranges  
 5 volt programming  
FIGURE 1 – PIN CONFIGURATION FOR WF128K32N-XH1X5  
Pin Description  
Top View  
I/O0-31  
Data Inputs/Outputs  
Address Inputs  
Write Enables  
Chip Selects  
A0-16  
I/O24  
I/O25  
I/O26  
A7  
VCC  
CS4#  
WE4#  
I/O27  
A4  
I/O31  
I/O30  
I/O29  
I/O28  
A1  
I/O8  
I/O9  
I/O10  
A14  
WE2#  
CS2#  
GND  
I/O11  
A10  
I/O15  
I/O14  
I/O13  
I/O12  
OE#  
NC  
WE1-4  
#
CS1-4  
OE#  
VCC  
#
Output Enable  
Power Supply  
Ground  
GND  
NC  
Not Connected  
A12  
A16  
Block Diagram  
NC  
A5  
A2  
A11  
A9  
WE1# CS1#  
WE2# CS2#  
WE3# CS3#  
WE4# CS4#  
128K x 8  
OE#  
A0-16  
A13  
A6  
A3  
A0  
A15  
WE1#  
I/O7  
A8  
WE3#  
CS3#  
GND  
I/O19  
I/O23  
I/O22  
I/O21  
I/O20  
NC  
I/O0  
I/O1  
I/O2  
VCC  
128K x 8  
128K x 8  
128K x 8  
I/O16  
I/O17  
I/O18  
CS1#  
NC  
I/O6  
8
8
8
8
I/O5  
I/O0-7  
I/O8-15  
I/O16-23  
I/O24-31  
I/O3  
I/O4  
Microsemi Corporation reserves the right to change products or specifications without notice.  
June 2012 © 2012 Microsemi Corporation. All rights reserved.  
Rev. 12  
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com  
1234567...11

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WF128K32N-60G2LM5A MICROSEMI

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 		Flash Module, 128KX32, 60ns, CQFP68, 22.4 MM, CERAMIC, QFP-68
WF128K32N-60G2UC5A MICROSEMI

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 		Flash Module, CQFP68, 22.4 MM, CERAMIC, QFP-68

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