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W83194BR-B PDF预览

W83194BR-B

更新时间: 2024-01-11 20:29:12
品牌 Logo 应用领域
华邦 - WINBOND 光电二极管
页数 文件大小 规格书
19页 232K
描述
Stepless Clock Gen. For INTEL Brookdale Chipset

W83194BR-B 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
Reach Compliance Code:not_compliant风险等级:5.92
JESD-30 代码:R-PDSO-G48JESD-609代码:e0
端子数量:48最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:SSOP封装等效代码:SSOP48,.4
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, SHRINK PITCH
电源:2.5/3.3,3.3 V认证状态:Not Qualified
子类别:Clock Generators最大压摆率:100 mA
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.635 mm
端子位置:DUALBase Number Matches:1

W83194BR-B 数据手册

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W83194BR-B Data Sheet Revision History  
NO. Page  
s
Dates  
Version  
Web  
Main Contents  
Version  
n.a.  
n.a.  
11  
n.a.  
1.0  
1.0  
All of the versions before 0.50 are for internal use.  
Change version and version on web site to 1.0  
1
2
4/1/2002  
1.0  
1.1  
10/1/2002  
Modify ratio table of CPU, 3V66, and PCI clock  
selection.  
3
All  
02/20/2003  
2.0  
2.0  
Update new form  
4
5
6
7
8
9
10  
Please note that all data and specifications are subject to change without notice. All  
the trademarks of products and companies mentioned in this data sheet belong to  
their respective owners.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or  
systems where malfunction of these products can reasonably be expected to result  
in personal injury. Winbond customers using or selling these products for use in such  
applications do so at their own risk and agree to fully indemnify Winbond for any  
damages resulting from such improper use or sales.  

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