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W29EE512P90Z PDF预览

W29EE512P90Z

更新时间: 2024-11-27 15:57:55
品牌 Logo 应用领域
华邦 - WINBOND 内存集成电路
页数 文件大小 规格书
25页 291K
描述
Flash, 64KX8, 90ns, PQCC32, LEAD FREE, PLASTIC, LCC-32

W29EE512P90Z 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:QFJ包装说明:LEAD FREE, PLASTIC, LCC-32
针数:32Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.84最长访问时间:90 ns
命令用户界面:NO数据轮询:YES
耐久性:1000 Write/Erase CyclesJESD-30 代码:R-PQCC-J32
JESD-609代码:e3长度:13.97 mm
内存密度:524288 bit内存集成电路类型:FLASH
内存宽度:8功能数量:1
部门数/规模:512端子数量:32
字数:65536 words字数代码:64000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:64KX8
封装主体材料:PLASTIC/EPOXY封装代码:QCCJ
封装等效代码:LDCC32,.5X.6封装形状:RECTANGULAR
封装形式:CHIP CARRIER页面大小:128 words
并行/串行:PARALLEL峰值回流温度(摄氏度):245
电源:5 V编程电压:5 V
认证状态:Not Qualified座面最大高度:3.56 mm
部门规模:128最大待机电流:0.0001 A
子类别:Flash Memories最大压摆率:0.05 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Matte Tin (Sn)端子形式:J BEND
端子节距:1.27 mm端子位置:QUAD
处于峰值回流温度下的最长时间:40切换位:YES
类型:NOR TYPE宽度:11.43 mm
最长写入周期时间 (tWC):10 msBase Number Matches:1

W29EE512P90Z 数据手册

 浏览型号W29EE512P90Z的Datasheet PDF文件第2页浏览型号W29EE512P90Z的Datasheet PDF文件第3页浏览型号W29EE512P90Z的Datasheet PDF文件第4页浏览型号W29EE512P90Z的Datasheet PDF文件第5页浏览型号W29EE512P90Z的Datasheet PDF文件第6页浏览型号W29EE512P90Z的Datasheet PDF文件第7页 
W29EE512  
64K × 8 CMOS FLASH MEMORY  
Table of Contents-  
1.  
2.  
3.  
4.  
5.  
6.  
GENERAL DESCRIPTION ......................................................................................................... 3  
FEATURES................................................................................................................................. 3  
PIN CONFIGURATIONS............................................................................................................. 4  
BLOCK DIAGRAM ...................................................................................................................... 4  
PIN DESCRIPTION..................................................................................................................... 4  
FUNCTIONAL DESCRIPTION.................................................................................................... 5  
6.1  
6.2  
6.3  
6.4  
6.5  
6.6  
6.7  
6.8  
Read Mode ..................................................................................................................... 5  
Page Write Mode............................................................................................................ 5  
Software-protected Data Write ....................................................................................... 5  
Hardware Data Protection .............................................................................................. 6  
Data Polling (DQ7)-Write Status Detection..................................................................... 6  
Toggle Bit (DQ6)-Write Status Detection........................................................................ 6  
5-Volt-only Software Chip Erase..................................................................................... 6  
Product Identification ...................................................................................................... 6  
7.  
8.  
TABLE OF OPERATING MODES .............................................................................................. 7  
7.1  
7.2  
Operating Mode Selection .............................................................................................. 7  
Command Codes for Software Data Protection ............................................................. 8  
7.2.1  
Command Codes for Software Chip Erase .................................................................... 9  
7.3.1 Software Chip Erase Acquisition Flow ...........................................................................9  
Command Codes for Product Identification.................................................................. 10  
7.4.1 Software Product Identification Acquisition Flow..........................................................10  
ELECTRICAL CHARACTERISTICS......................................................................................... 11  
Software Data Protection Acquisition Flow ....................................................................8  
7.3  
7.4  
8.1  
8.2  
8.3  
8.4  
8.5  
Absolute Maximum Ratings.......................................................................................... 11  
Operating Characteristics ............................................................................................. 11  
Power-up Timing........................................................................................................... 12  
Capacitance.................................................................................................................. 12  
AC Characteristics........................................................................................................ 12  
8.5.1  
8.5.2  
8.5.3  
8.5.4  
AC Test Conditions......................................................................................................12  
AC Test Load and Waveform......................................................................................12  
Read Cycle Timing Parameters ...................................................................................13  
Byte/Page-write Cycle Timing Parameters...................................................................13  
(1)  
8.5.5  
#DATA Polling Characteristics  
................................................................................14  
Publication Release Date: April 15, 2005  
Revision A9  
- 1 -  

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