是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | QFP | 包装说明: | MO-108, QFP-100 |
针数: | 100 | Reach Compliance Code: | not_compliant |
ECCN代码: | 3A991.B.2.A | HTS代码: | 8542.32.00.41 |
风险等级: | 5.92 | Is Samacsys: | N |
最长访问时间: | 7 ns | I/O 类型: | COMMON |
JESD-30 代码: | R-PQFP-G100 | JESD-609代码: | e0 |
长度: | 20 mm | 内存密度: | 4194304 bit |
内存集成电路类型: | STANDARD SRAM | 内存宽度: | 64 |
功能数量: | 1 | 端子数量: | 100 |
字数: | 65536 words | 字数代码: | 64000 |
工作模式: | SYNCHRONOUS | 最高工作温度: | 55 °C |
最低工作温度: | 组织: | 64KX64 | |
输出特性: | 3-STATE | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | QFP | 封装等效代码: | QFP100,.7X.9,32 |
封装形状: | RECTANGULAR | 封装形式: | FLATPACK |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 3.32 mm | 最大待机电流: | 0.08 A |
最小待机电流: | 3.15 V | 子类别: | SRAMs |
最大压摆率: | 0.35 mA | 最大供电电压 (Vsup): | 3.6 V |
最小供电电压 (Vsup): | 3.15 V | 标称供电电压 (Vsup): | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 14 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
W25P240AF-7 | WINBOND |
获取价格 |
Standard SRAM, 64KX64, 7ns, CMOS, PQFP100, MO-108, QFP-100 | |
W25P243A | WINBOND |
获取价格 |
64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM | |
W25P243A-4A | WINBOND |
获取价格 |
64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM | |
W25P243A-5 | WINBOND |
获取价格 |
64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM | |
W25P243A-6 | WINBOND |
获取价格 |
64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM | |
W25P243AD-4A | WINBOND |
获取价格 |
64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM | |
W25P243AD-5 | WINBOND |
获取价格 |
64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM | |
W25P243AD-6 | WINBOND |
获取价格 |
64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM | |
W25P243AF-4A | WINBOND |
获取价格 |
64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM | |
W25P243AF-5 | WINBOND |
获取价格 |
64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM |