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VSC8244HG PDF预览

VSC8244HG

更新时间： 2024-02-25 14:38:51
品牌 Logo 应用领域
美国微芯 - MICROCHIP 以太网：16GBASE-T电信电信集成电路
页数 文件大小 规格书
121页 907K
描述
Ethernet Transceiver

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中文翻译

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VSC8244HG 技术参数

生命周期：Obsolete包装说明：HBGA, BGA260,18X18,40
Reach Compliance Code：compliantHTS代码：8542.39.00.01
风险等级：5.67数据速率：1000000 Mbps
JESD-30 代码：S-PBGA-B260长度：19 mm
功能数量：4端子数量：260
收发器数量：4最高工作温度：100 °C
最低工作温度：封装主体材料：PLASTIC/EPOXY
封装代码：HBGA封装等效代码：BGA260,18X18,40
封装形状：SQUARE封装形式：GRID ARRAY, HEAT SINK/SLUG
电源：1.2,3.3 V认证状态：Not Qualified
座面最大高度：2 mm子类别：Network Interfaces
标称供电电压：1.2 V表面贴装：YES
技术：CMOS电信集成电路类型：ETHERNET TRANSCEIVER
温度等级：OTHER端子形式：BALL
端子节距：1 mm端子位置：BOTTOM
宽度：19 mmBase Number Matches：1

VSC8244HG 数据手册

 浏览型号VSC8244HG的Datasheet PDF文件第4页浏览型号VSC8244HG的Datasheet PDF文件第5页浏览型号VSC8244HG的Datasheet PDF文件第6页浏览型号VSC8244HG的Datasheet PDF文件第8页浏览型号VSC8244HG的Datasheet PDF文件第9页浏览型号VSC8244HG的Datasheet PDF文件第10页 
VSC8244  
Data Sheet  
24.39 Register 22E (16h) - EEPROM Data Read/Write Register .......................................................................................93  
24.40 Register 23E (17h) - Extended PHY Control Register #4 .........................................................................................93  
24.41 Register 24E (18h) – Reserved ................................................................................................................................94  
24.42 Register 25E (19h) – Reserved ................................................................................................................................94  
24.43 Register 26E (1Ah) – Reserved ................................................................................................................................94  
24.44 Register 27E (1Bh) – Reserved ................................................................................................................................94  
24.45 Register 28E (1Ch) – Reserved................................................................................................................................ 94  
24.46 Register 29E (1Dh) - 1000BASE-T Ethernet Packet Generator (EPG) Register #1................................................. 95  
25 Electrical Specifications ................................................................................................................................ 96  
25.1 Absolute Maximum Ratings ......................................................................................................................................96  
25.2 Recommended Operating Conditions .......................................................................................................................97  
25.3 Thermal Application Data ..........................................................................................................................................98  
25.4 Package Thermal Specifications - 260 HS-PBGA ...................................................................................................98  
25.5 Current and Power Consumption Estimates .............................................................................................................99  
25.6 DC Specifications ...................................................................................................................................................100  
25.7 Clocking Specifications ...........................................................................................................................................102  
25.8 System Timing Specifications .................................................................................................................................103  
26 Packaging Specifications .............................................................................................................................115  
26.1 19mm HS-PBGA Mechanical Specification ............................................................................................................ 115  
26.2 Package Moisture Sensitivity .................................................................................................................................. 115  
27 Ordering Information.....................................................................................................................................116  
27.1 Devices ................................................................................................................................................................... 116  
27.2 Related Devices ...................................................................................................................................................... 116  
28 Design Guidelines .........................................................................................................................................117  
28.1 Required SMI Register Write Sequence ................................................................................................................. 117  
28.2 Interoperability with Intel 82547E1 L322SQ96 ....................................................................................................... 117  
29 Product Support ............................................................................................................................................119  
29.1 Available Documents and Application Notes .......................................................................................................... 119  
30 Document History & Notices....................................................................................................................... 120  
7 of 7  
VMDS-10108 Revision 4.1  
7
June 2006  
1...45678910...121

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