UMC2NT1, UMC3NT1,
UMC5NT1
Preferred Devices
Dual Common
Base−Collector Bias
Resistor Transistors
http://onsemi.com
NPN and PNP Silicon Surface Mount
Transistors with Monolithic Bias
Resistor Network
3
2
1
R1
R2
The Bias Resistor Transistor (BRT) contains a single transistor with
a monolithic bias network consisting of two resistors; a series base
resistor and a base−emitter resistor. These digital transistors are
designed to replace a single device and its external resistor bias
network. The BRT eliminates these individual components by
integrating them into a single device. In the UMC2NT1 series, two
complementary BRT devices are housed in the SOT−353 package
which is ideal for low power surface mount applications where board
space is at a premium.
Q2
R2
Q1
R1
4
5
Features
MARKING
DIAGRAM
• Simplifies Circuit Design
• Reduces Board Space
• Reduces Component Count
5
4
• Available in 8 mm, 7 inch/3000 Unit Tape and Reel
• Pb−Free Packages are Available
SC−88A/SOT−353
CASE 419A
STYLE 6
Ux M G
G
1
2
3
MAXIMUM RATINGS (T = 25°C unless otherwise noted, common for Q
A
1
and Q , − minus sign for Q (PNP) omitted)
2
1
Ux
x
M
G
= Device Marking
= 2, 3 or 5
= Date Code
= Pb−Free Package
Rating
Symbol
Value
50
Unit
Collector-Base Voltage
Collector-Emitter Voltage
Collector Current
V
Vdc
Vdc
CBO
V
50
CEO
(Note: Microdot may be in either location)
I
100
mAdc
C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
THERMAL CHARACTERISTICS
Preferred devices are recommended choices for future use
Thermal Resistance − Junction-to-Ambient
(surface mounted)
R
833
°C/W
°C
and best overall value.
q
JA
Operating and Storage Temperature Range
T , T
J
−65 to
+150
stg
Total Package Dissipation
P
*150
mW
D
@ T = 25°C (Note 1)
A
1. Device mounted on a FR-4 glass epoxy printed circuit board using the
minimum recommended footprint.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
April, 2006 − Rev. 6
UMC2NT1/D