UMC2NT1, UMC3NT1,
UMC5NT1
Preferred Devices
Dual Common
Base−Collector Bias
Resistor Transistors
http://onsemi.com
NPN and PNP Silicon Surface Mount
Transistors with Monolithic Bias
Resistor Network
3
2
1
R1
R2
The Bias Resistor Transistor (BRT) contains a single transistor with
a monolithic bias network consisting of two resistors; a series base
resistor and a base−emitter resistor. These digital transistors are
designed to replace a single device and its external resistor bias
network. The BRT eliminates these individual components by
integrating them into a single device. In the UMC2NT1 series, two
complementary BRT devices are housed in the SOT−353 package
which is ideal for low power surface mount applications where board
space is at a premium.
Q2
R2
Q1
R1
4
5
Features
MARKING
DIAGRAM
• Pb−Free Packages are Available
• Simplifies Circuit Design
• Reduces Board Space
• Reduces Component Count
• Available in 8 mm, 7 inch/3000 Unit Tape and Reel
5
4
d
SC−88A/SOT−353
CASE 419A
STYLE 6
Ux
1
2
3
MAXIMUM RATINGS (T = 25°C unless otherwise noted, common for Q
A
1
and Q , − minus sign for Q (PNP) omitted)
2
1
Rating
Collector-Base Voltage
Symbol
Value
50
Unit
Ux = Device Marking
V
CBO
Vdc
Vdc
x
= 2, 3 or 5
d
= Date Code
Collector-Emitter Voltage
Collector Current
V
CEO
50
I
C
100
mAdc
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
THERMAL CHARACTERISTICS
Thermal Resistance − Junction-to-Ambient
(surface mounted)
R
833
°C/W
°C
θ
JA
Operating and Storage Temperature Range
T , T
J
−65 to
+150
stg
Total Package Dissipation
P
D
*150
mW
@ T = 25°C (Note 1)
A
1. Device mounted on a FR-4 glass epoxy printed circuit board using the
minimum recommended footprint.
Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
September, 2004 − Rev. 5
UMC2NT1/D