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TMS5703134APGEQQ1 PDF预览

TMS5703134APGEQQ1

更新时间: 2024-10-28 11:58:23
品牌 Logo 应用领域
德州仪器 - TI 闪存微控制器
页数 文件大小 规格书
155页 2867K
描述
TMS570LSxxx4 16/32-Bit RISC Flash Microcontroller

TMS5703134APGEQQ1 技术参数

生命周期:Obsolete零件包装代码:QFP
包装说明:LFQFP,针数:144
Reach Compliance Code:unknownECCN代码:3A001.A.3
HTS代码:8542.31.00.01风险等级:5.84
具有ADC:YES其他特性:ALSO OPERATES AT 3.3 V NOMINAL I/O SUPPLY
地址总线宽度:位大小:32
最大时钟频率:80 MHzDAC 通道:NO
DMA 通道:YES外部数据总线宽度:
JESD-30 代码:S-PQFP-G144长度:20 mm
I/O 线路数量:4端子数量:144
最高工作温度:105 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:LFQFP封装形状:SQUARE
封装形式:FLATPACK, LOW PROFILE, FINE PITCHROM可编程性:FLASH
筛选级别:AEC-Q100座面最大高度:1.6 mm
速度:160 MHz最大供电电压:1.32 V
最小供电电压:1.14 V标称供电电压:1.2 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
宽度:20 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC
Base Number Matches:1

TMS5703134APGEQQ1 数据手册

 浏览型号TMS5703134APGEQQ1的Datasheet PDF文件第2页浏览型号TMS5703134APGEQQ1的Datasheet PDF文件第3页浏览型号TMS5703134APGEQQ1的Datasheet PDF文件第4页浏览型号TMS5703134APGEQQ1的Datasheet PDF文件第5页浏览型号TMS5703134APGEQQ1的Datasheet PDF文件第6页浏览型号TMS5703134APGEQQ1的Datasheet PDF文件第7页 
TMS570LS3134  
TMS570LS2134  
TMS570LS2124  
www.ti.com  
SPNS165SEPTEMBER 2011  
TMS570LSxxx4 16/32-Bit RISC Flash Microcontroller  
Check for Samples: TMS570LS3134  
1 TMS570LSxxx4 16/32-Bit RISC Flash Microcontroller  
1.1 Features  
1
High-Performance Microcontroller for Safety  
Multiple Communication Interfaces  
10/100 Mbps Ethernet MAC (EMAC)  
Critical Applications  
Dual CPUs running in lockstep  
ECC on flash and RAM interfaces  
IEEE 802.3 compliant (3.3V-I/O only)  
Supports MII and MDIO  
Built-In Self Test for CPU and on-chip RAMs  
Error Signaling Module with Error Pin  
Voltage and Clock Monitoring  
Three CAN Controllers (DCAN)  
64 mailboxes with parity protection each  
Compliant to CAN protocol version 2.0B  
Inter-Integrated Circuit (I2C)  
ARM® Cortex™ – R4F 32-bit RISC CPU  
Efficient 1.6DMIPS/MHz with 8-stage pipeline  
Three Multi-buffered Serial Peripheral  
Floating-Point Unit with Single/Double  
Interfaces (MibSPI)  
Precision  
128 Words with Parity Protection each  
12-Region Memory Protection Unit  
Open Architecture with 3rd Party Support  
Operating Conditions  
Two Standard Serial Peripheral Interfaces  
(SPI)  
Local Interconnect Network Interface (LIN)  
Controller  
Up to 180MHz System Clock  
Compliant to LIN protocol version 2.1  
Core Supply Voltage (VCC): 1.2V nominal  
I/O Supply Voltage (VCCIO): 3.3V nominal  
Integrated Memory  
Up to 3MB Program Flash with ECC  
Up to 256KB RAM with ECC  
64KB Flash for emulated EEPROM  
16- bit External Memory Interface  
Common Platform Architecture  
Consistent memory map across family  
Real-Time Interrupt Timer (RTI) OS Timer  
96-channel Vectored Interrupt Module (VIM)  
2-channel Cyclic Redundancy Checker (CRC)  
Direct Memory Access (DMA) Controller  
16 Channels and 32 Control Packets  
Parity protection for control packet RAM  
DMA Accesses Protected by Dedicated MPU  
Standard Serial Communication Interface  
(SCI)  
Two High-End Timer Modules (N2HET)  
N2HET1: 32 programmable channels  
N2HET2: 20 programmable channels  
160 Word Instruction RAM with parity  
protection each  
Each includes Hardware Angle Generator  
Dedicated Transfer Unit for each N2HET  
(HTU)  
Two 10/12-bit Multi-Buffered ADC Modules  
ADC1: 24 channels  
ADC2: 16 channels  
16 shared channels  
64 result buffers with parity protection each  
Packages  
Frequency-Modulated Phase-Locked-Loop  
(FMPLL) with Built-In Slip Detector  
Separate Non-Modulating PLL  
144-pin Quad Flatpack (PGE) [Green]  
337-Ball Grid Array (ZWT) [Green]  
IEEE 1149.1 JTAG, Boundary Scan and ARM  
CoreSight Components  
JTAG Security Module  
Trace and Calibration Capabilities  
Embedded Trace Macrocell (ETM-R4)  
Data Modification Module (DMM)  
RAM Trace Port (RTP)  
Parameter Overlay Module (POM)  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCT PREVIEW information concerns products in the formative  
Copyright © 2011, Texas Instruments Incorporated  
or design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right  
to change or discontinue these products without notice.  
 
 

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