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TMS5703135DPGEQQ1 PDF预览

TMS5703135DPGEQQ1

更新时间: 2024-10-29 11:06:19
品牌 Logo 应用领域
德州仪器 - TI 时钟外围集成电路装置闪存
页数 文件大小 规格书
154页 2867K
描述
16/32 位 RISC 闪存 MCU,Arm Cortex-R4F,FlexRay | PGE | 144 | -40 to 125

TMS5703135DPGEQQ1 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:LQFP-144
Reach Compliance Code:compliantFactory Lead Time:6 weeks
风险等级:5.78具有ADC:YES
地址总线宽度:位大小:32
边界扫描:YESCPU系列:CORTEX-R4F
最大时钟频率:80 MHzDAC 通道:NO
DMA 通道:YES外部数据总线宽度:
格式:FLOATING POINT集成缓存:NO
JESD-30 代码:S-PQFP-G144JESD-609代码:e4
长度:20 mm低功率模式:YES
湿度敏感等级:3DMA 通道数量:16
外部中断装置数量:4I/O 线路数量:58
串行 I/O 数:7端子数量:144
计时器数量:51片上数据RAM宽度:8
片上程序ROM宽度:8最高工作温度:125 °C
最低工作温度:-40 °CPWM 通道:NO
封装主体材料:PLASTIC/EPOXY封装代码:LFQFP
封装形状:SQUARE封装形式:FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):NOT SPECIFIEDRAM(字节):262144
ROM(单词):3145728ROM可编程性:FLASH
筛选级别:AEC-Q100座面最大高度:1.6 mm
速度:160 MHz最大压摆率:700 mA
最大供电电压:1.32 V最小供电电压:1.14 V
标称供电电压:1.2 V表面贴装:YES
技术:CMOS温度等级:AUTOMOTIVE
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:20 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLER, RISCBase Number Matches:1

TMS5703135DPGEQQ1 数据手册

 浏览型号TMS5703135DPGEQQ1的Datasheet PDF文件第2页浏览型号TMS5703135DPGEQQ1的Datasheet PDF文件第3页浏览型号TMS5703135DPGEQQ1的Datasheet PDF文件第4页浏览型号TMS5703135DPGEQQ1的Datasheet PDF文件第5页浏览型号TMS5703135DPGEQQ1的Datasheet PDF文件第6页浏览型号TMS5703135DPGEQQ1的Datasheet PDF文件第7页 
TMS570LS2125  
TMS570LS2135  
TMS570LS3135  
www.ti.com  
SPNS164SEPTEMBER 2011  
TMS570LSxxx5 16/32-Bit RISC Flash Microcontroller  
Check for Samples: TMS570LS2125  
1 TMS570LSxxx5 16/32-Bit RISC Flash Microcontroller  
1.1 Features  
1
High-Performance Automotive Grade  
Multiple Communication Interfaces  
FlexRay Controller with 2 channels  
Microcontroller for Safety Critical Applications  
Dual CPUs running in lockstep  
ECC on flash and RAM interfaces  
8KB message RAM with parity protection  
Dedicated Transfer Unit (FTU)  
Built-In Self Test for CPU and on-chip RAMs  
Error Signaling Module with Error Pin  
Voltage and Clock Monitoring  
Three CAN Controllers (DCAN)  
64 mailboxes with parity protection each  
Compliant to CAN protocol version 2.0B  
Inter-Integrated Circuit (I2C)  
ARM® Cortex™ – R4F 32-bit RISC CPU  
Efficient 1.6DMIPS/MHz with 8-stage pipeline  
Three Multi-buffered Serial Peripheral  
Floating-Point Unit with Single/Double  
Interfaces (MibSPI)  
Precision  
128 Words with Parity Protection each  
12-Region Memory Protection Unit  
Open Architecture with 3rd Party Support  
Operating Conditions  
Two Standard Serial Peripheral Interfaces  
(SPI)  
Local Interconnect Network Interface (LIN)  
Controller  
Up to 180MHz System Clock  
Compliant to LIN protocol version 2.1  
Core Supply Voltage (VCC): 1.2V nominal  
I/O Supply Voltage (VCCIO): 3.3V nominal  
Integrated Memory  
Up to 3MB Program Flash with ECC  
Up to 256KB RAM with ECC  
64KB Flash for emulated EEPROM  
16- bit External Memory Interface  
Common Platform Architecture  
Consistent memory map across family  
Real-Time Interrupt Timer (RTI) OS Timer  
96-channel Vectored Interrupt Module (VIM)  
2-channel Cyclic Redundancy Checker (CRC)  
Direct Memory Access (DMA) Controller  
16 Channels and 32 Control Packets  
Parity protection for control packet RAM  
DMA Accesses Protected by Dedicated MPU  
Standard Serial Communication Interface  
(SCI)  
Two High-End Timer Modules (N2HET)  
N2HET1: 32 programmable channels  
N2HET2: 20 programmable channels  
160 Word Instruction RAM with parity  
protection each  
Each includes Hardware Angle Generator  
Dedicated Transfer Unit for each N2HET  
(HTU)  
Two 10/12-bit Multi-Buffered ADC Modules  
ADC1: 24 channels  
ADC2: 16 channels  
16 shared channels  
64 result buffers with parity protection each  
Packages  
Frequency-Modulated Phase-Locked-Loop  
(FMPLL) with Built-In Slip Detector  
Separate Non-Modulating PLL for FlexRay  
144-pin Quad Flatpack (PGE) [Green]  
337-Ball Grid Array (ZWT) [Green]  
IEEE 1149.1 JTAG, Boundary Scan and ARM  
CoreSight Components  
JTAG Security Module  
Trace and Calibration Capabilities  
Embedded Trace Macrocell (ETM-R4)  
Data Modification Module (DMM)  
RAM Trace Port (RTP)  
Parameter Overlay Module (POM)  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCT PREVIEW information concerns products in the formative  
Copyright © 2011, Texas Instruments Incorporated  
or design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right  
to change or discontinue these products without notice.  
 
 

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