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TMS465169-60DGE PDF预览

TMS465169-60DGE

更新时间: 2024-11-12 18:50:03
品牌 Logo 应用领域
德州仪器 - TI 动态存储器光电二极管内存集成电路
页数 文件大小 规格书
30页 459K
描述
4MX16 EDO DRAM, 60ns, PDSO50, 0.400 INCH, PLASTIC, TSOP-50

TMS465169-60DGE 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP包装说明:TSOP2, TSOP50,.46,32
针数:50Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8542.32.00.02
风险等级:5.31访问模式:FAST PAGE WITH EDO
最长访问时间:60 ns其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O 类型:COMMONJESD-30 代码:R-PDSO-G50
长度:20.95 mm内存密度:67108864 bit
内存集成电路类型:EDO DRAM内存宽度:16
功能数量:1端口数量:1
端子数量:50字数:4194304 words
字数代码:4000000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:4MX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装等效代码:TSOP50,.46,32封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE峰值回流温度(摄氏度):NOT SPECIFIED
电源:3.3 V认证状态:Not Qualified
刷新周期:4096座面最大高度:1.2 mm
自我刷新:NO最大待机电流:0.0005 A
子类别:DRAMs最大压摆率:0.11 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:MOS温度等级:COMMERCIAL
端子形式:GULL WING端子节距:0.8 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:10.16 mmBase Number Matches:1

TMS465169-60DGE 数据手册

 浏览型号TMS465169-60DGE的Datasheet PDF文件第2页浏览型号TMS465169-60DGE的Datasheet PDF文件第3页浏览型号TMS465169-60DGE的Datasheet PDF文件第4页浏览型号TMS465169-60DGE的Datasheet PDF文件第5页浏览型号TMS465169-60DGE的Datasheet PDF文件第6页浏览型号TMS465169-60DGE的Datasheet PDF文件第7页 
TMS465169, TMS465169P  
4194304 BY 16-BIT EXTENDED DATA OUT  
DYNAMIC RANDOM-ACCESS MEMORIES  
SMHS566B – JUNE 1997 – REVISED APRIL 1998  
DGE PACKAGE  
(TOP VIEW)  
Organization . . . 4194304 by 16 Bits  
Single 3.3-V Power Supply (± 0.3 V  
Tolerance)  
Performance Ranges:  
V
V
SS  
1
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
CC  
DQ0  
DQ1  
DQ2  
DQ3  
DQ15  
DQ14  
DQ13  
DQ12  
2
ACCESS ACCESS ACCESS  
EDO  
CYCLE  
3
TIME TIME TIME  
t
t
t
t
4
RAC  
CAC  
AA  
HPC  
MAX  
50 ns  
60 ns  
MAX  
13 ns  
15 ns  
MAX  
25 ns  
30 ns  
MIN  
20 ns  
25 ns  
5
’46x169/P-50  
’46x169/P-60  
V
V
6
CC  
SS  
DQ4  
DQ5  
DQ6  
DQ7  
NC  
DQ11  
DQ10  
DQ9  
DQ8  
NC  
7
Extended-Data-Out (EDO) Operation  
xCAS-Before-RAS (xCBR) Refresh  
Long Refresh Period and Self-Refresh  
Option (TMS46x169P)  
3-State Unlatched Output  
Low Power Dissipation  
High-Reliability Plastic 50-Lead  
400-Mil-Wide Surface-Mount Thin  
Small-Outline Package (TSOP) (DGE Suffix)  
Operating Free-Air Temperature Range  
8
9
10  
11  
12  
13  
V
V
CC  
SS  
W
RAS  
NC  
NC  
W
LCAS  
UCAS  
OE  
14  
15  
37  
36  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
NC  
NC  
A12/NC  
A11  
A10  
A9  
0°C to 70°C  
NC  
A0  
AVAILABLE OPTIONS  
SELF-  
A1  
A2  
POWER  
SUPPLY  
REFRESH  
CYCLES  
REFRESH,  
BATTERY  
BACKUP  
A3  
A4  
A5  
A8  
A7  
A6  
DEVICE  
TMS465169  
3.3 V  
3.3 V  
4096 in 64 ms  
4096 in 128 ms  
V
V
SS  
CC  
TMS465169P  
Yes  
description  
PIN NOMENCLATURE  
The and TMS465169 is  
a
high-speed,  
A0A12  
Address Inputs  
Data In/Data Out  
67108864-bit dynamic random-access memory  
(DRAM) device organized as 4194304 words of  
16 bits. The TMS465169P is similar DRAM but  
includes a long refresh period and a self-refresh  
option. Both employ state-of-the-art technology  
for high performance, reliability, and low power at  
low cost.  
DQ0DQ15  
LCAS  
UCAS  
NC  
Lower Column-Address Strobe  
Upper Column-Address Strobe  
No Internal Connection  
Output Enable  
Row-Address Strobe  
3.3-V Supply  
OE  
RAS  
V
V
W
CC  
SS  
Ground  
Write Enable  
A12 is NC for TMS465169 and TMS465169P.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1998, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  

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