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TK12X53D(TE24L,Q) PDF预览

TK12X53D(TE24L,Q)

更新时间: 2024-10-02 19:51:51
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
6页 188K
描述
TRANSISTOR,MOSFET,N-CHANNEL,525V V(BR)DSS,12A I(D),SC-97

TK12X53D(TE24L,Q) 技术参数

是否Rohs认证: 符合生命周期:End Of Life
包装说明:,Reach Compliance Code:unknown
风险等级:5.76配置:Single
最大漏极电流 (Abs) (ID):12 AFET 技术:METAL-OXIDE SEMICONDUCTOR
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):150 W
子类别:FET General Purpose Power表面贴装:YES
Base Number Matches:1

TK12X53D(TE24L,Q) 数据手册

 浏览型号TK12X53D(TE24L,Q)的Datasheet PDF文件第2页浏览型号TK12X53D(TE24L,Q)的Datasheet PDF文件第3页浏览型号TK12X53D(TE24L,Q)的Datasheet PDF文件第4页浏览型号TK12X53D(TE24L,Q)的Datasheet PDF文件第5页浏览型号TK12X53D(TE24L,Q)的Datasheet PDF文件第6页 
TK12X53D  
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (π-MOS)  
TK12X53D  
Switching Regulator Applications  
Unit: mm  
9.2 MAX.  
7.0 ± 0.2  
0.4 ± 0.1  
Low drain-source ON resistance: R  
High forward transfer admittance: Y = 6.0 S (typ.)  
= 0.5 (typ.)  
DS (ON)  
4
fs  
Low leakage current: I  
= 10 μA (max) (V  
= 525 V)  
DSS  
DS  
Enhancement-mode: V = 2.0 to 4.0 V (V  
= 10 V, I = 1 mA)  
D
th  
DS  
Absolute Maximum Ratings (Ta = 25°C)  
2.0 1.5 2.0 2.5  
1
2
3
Characteristics  
Drain-source voltage  
Symbol  
Rating  
Unit  
V
V
525  
±30  
12  
V
V
DSS  
Gate-source voltage  
3.6 ± 0.2  
GSS  
1.0 ± 0.2 1.0 ± 0.2  
DC  
(Note 1)  
I
D
Drain current  
A
G  
1. GATE  
2. N.C.  
3. SOURCE  
4. DRAIN  
Pulse (Note 1)  
I
48  
DP  
Drain power dissipation (Tc = 25°C)  
P
150  
W
S  
D  
D
AS  
AR  
Single pulse avalanche energy  
E
378  
mJ  
(Note 2)  
JEDEC  
Avalanche current  
I
12  
15  
A
JEITA  
SC-97  
Repetitive avalanche energy (Note 3)  
Channel temperature  
E
mJ  
°C  
°C  
AR  
TOSHIBA  
2-9F1C  
T
ch  
150  
Weight : 0.74 g (typ.)  
Storage temperature range  
T
stg  
55 to 150  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability  
Handbook (“Handling Precautions”/“Derating Concept and Methods’’) and individual reliability data (i.e.  
reliability test report and estimated failure rate, etc).  
Internal Connection  
Thermal Characteristics  
Characteristics  
Symbol  
Max  
Unit  
4
Thermal resistance, channel to case  
R
0.833  
°C/W  
th (ch-c)  
Note 1: Please use devices on conditions that the channel temperature is below 150°C.  
Note 2: = 90 V, T = 25°C (initial), L = 4.5 mH, R = 25 Ω, I = 12 A  
V
DD  
ch  
G
AR  
1
Note 3: Repetitive rating: pulse width limited by maximum channel temperature  
This transistor is an electrostatic sensitive device. Please handle with caution.  
3
1
2010-08-27  

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