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TFDS6500E

更新时间： 2024-09-17 22:19:51
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
12页 552K
描述
2.7-5.5V Fast Infrared Transceiver Module Family

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TFDS6500E 数据手册

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TELEFUNKEN  
Semiconductors  
TFDU6100E/TFDS6500E/TFDT6500E  
2.7–5.5V Fast Infrared Transceiver Module Family  
(FIR, 4 Mbit/s)  
Features  
Applications  
D Compliant to IrDA 1.2 (Up to  
4 Mbit/s), HP–SIR, Sharp ASK  
and TV Remote  
D BabyFace (Universal) Package  
Capable of Surface Mount  
Solderability to Side and Top  
View Orientation  
D Directly Interfaces With Various  
Super I/O and Controller Devices  
D Built–In EMI Protection – No  
External Shielding Necessary  
D Few External Components  
Required  
D Notebook Computers, Desktop  
PCs, Palmtop Computers (Win  
CE, Palm PC), PDAs  
D Digital Still and Video Cameras  
D Printers, Fax Machines,  
Photocopiers, Screen Projectors  
D Telecommunication Products  
(Cellular Phones, Pagers)  
D Internet TV Boxes, Video  
Conferencing Systems  
D Wide Operating Voltage Range  
(2.7 to 5.5 V )  
D Low-Power Consumption (3 mA  
Supply Current)  
D Power Shutdown Mode (1 mA  
Shutdown Current)  
D Long Range (Up to 2.0 m at  
4 Mbit/s in Nominal Design)  
D High Efficiency Emitter  
(120 mW/sr min "15_)  
D Backward Compatible to All  
TEMIC SIR and FIR Infrared  
Transceivers  
D External Infrared Adapters  
(Dongles)  
D Medical and Industrial Data  
Collection Devices  
D Three Surface Mount Package  
Options  
– Universal (9.7 x 4.7 x 4.0 mm)  
– Side View (13.0x5.95x5.3mm)  
– Top View (13.0x7.6x5.95mm)  
Description  
The TFDU6100E, TFDS6500E, and TFDT6500E are a wide selection provides flexibility for a variety of  
family of low-power infrared transceiver modules applications and space constraints.  
compliant to the IrDA 1.2 standard for fast infrared (FIR)  
data communication, supporting IrDA speeds up to 4.0 The transceivers are capable of directly interfacing with  
Mbit/s, HP–SIR, Sharp ASK and carrier based remote a wide variety of I/O chips which perform the pulse-width  
control modes up to 2 MHz. Integrated within the modulation/demodulation function, including National  
transceiver modules are a photo PIN diode, infrared Semiconductor’s PC87338, PC87108 and PC87109,  
emitter (IRED), and a low-power CMOS control IC to SMSC’s FDC37C669, FDC37N769 and CAM35C44,  
provide a total front–end solution in a single package. and Hitachi’s SH3. At a minimum, a current-limiting  
TEMIC’s FIR transceivers are available in three package resistor in series with the infrared emitter and a V  
CC  
options, including our BabyFace package (TFDU6100E), bypass capacitor are the only external components  
the smallest FIR transceiver available on the market. This required to implement a complete solution.  
Package Options  
TFDU6100E  
Baby Face (Universal)  
TFDS6500E  
Side View  
TFDT6500E  
Top View  
This product is currently in devleopment. Inquiries regarding the status of this product should be directed to TEMIC Marketing.  
Pending—Rev. A, 03-Apr-98  
1
Pre-Release Information  
1234567...12

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