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TFDT4500

更新时间： 2024-09-17 22:19:51
品牌 Logo 应用领域
威世 - VISHAY 传感器换能器线性位置传感器栅
页数 文件大小 规格书
12页 557K
描述
2.7-5.5V Serial Infrared Transceiver Module Family

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中文翻译

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TFDT4500 技术参数

生命周期：Obsolete包装说明：,
Reach Compliance Code：unknown风险等级：5.68
接口集成电路类型：INTERFACE CIRCUITJESD-30 代码：R-XSMA-G8
功能数量：1端子数量：8
封装主体材料：UNSPECIFIED封装形状：RECTANGULAR
封装形式：MICROELECTRONIC ASSEMBLY认证状态：Not Qualified
表面贴装：YES端子形式：GULL WING
端子位置：SINGLEBase Number Matches：1

TFDT4500 数据手册

 浏览型号TFDT4500的Datasheet PDF文件第2页浏览型号TFDT4500的Datasheet PDF文件第3页浏览型号TFDT4500的Datasheet PDF文件第4页浏览型号TFDT4500的Datasheet PDF文件第5页浏览型号TFDT4500的Datasheet PDF文件第6页浏览型号TFDT4500的Datasheet PDF文件第7页 
TELEFUNKEN  
Semiconductor  
TFDU4100/TFDS4500/TFDT4500  
2.7–5.5V Serial Infrared Transceiver Module Family  
(SIR, 115.2 kbit/s)  
Features  
Applications  
D Compliant to IrDA 1.2 (up to  
D BabyFace (Universal) Package  
Capable of Surface Mount  
Solderability to Side- and  
Top-View Orientation  
D Directly Interfaces with Various  
Super I/O and Controller Devices  
and TEMIC’s TOIM3000 and  
TOIM3232 I/Os  
D Notebook Computers, Desktop  
PCs, Palmtop Computers (Win  
CE, Palm PC), PDAs  
D Digital Still and Video Cameras  
D Printers, Fax Machines,  
Photocopiers, Screen Projectors  
D Telecommunication Products  
(Cellular Phones, Pagers)  
D Internet TV Boxes, Video  
conferencing systems  
115.2 kbit/s)  
D Wide Operating Voltage Range  
(2.7 to 5.5 V )  
D Low Power Consumption  
(1.3 mA Supply Current)  
D Power Sleep Mode Through  
V
CC1  
/SD Pin (5 nA Sleep  
D Few External Components  
Current)  
Required  
D Long Range (up to 3.0 m at 115.2  
D Backward Compatible to All  
TEMIC SIR Infrared  
kbit/s)  
D External Infrared Adapters  
D Three Surface Mount Package  
Options  
– Universal (9.7 x 4.7 x 4.0 mm)  
– Side View (13.0x5.95x5.3mm)  
– Top View (13.0x7.6x5.95mm)  
(Dongles)  
Transceivers  
D Medical and Industrial Data  
Collection Devices  
D Built–in EMI Protection – No  
External Shielding Necessary  
Description  
The TFDU4100, TFDS4500, and TFDT4500 are a family provides flexibility for a variety of applications and space  
of low-power infrared transceiver modules compliant to constraints.  
the IrDA 1.2 standard for serial infrared (SIR) data  
communication, supporting IrDA speeds up to 115.2  
kbit/s. Integrated within the transceiver modules are a The transceivers are capable of directly interfacing with  
photo PIN diode, infrared emitter (IRED), and a a wide variety of I/O chips which perform the pulse-width  
low-power analog control IC to provide a total front–end modulation/demodulation function, including TEMIC’s  
solution in a single package. TEMIC’s SIR transceivers TOIM3000 and TOIM3232.  
At a minimum, a  
are available in three package options, including our current-limiting resistor in series with the infrared emitter  
BabyFace package (TFDU4100), the smallest SIR and a Vcc bypass capacitor are the only external  
transceiver available on the market. This wide selection components required to implement a complete solution.  
Package Options  
TFDU4100  
Baby Face (Universal)  
TFDS4500  
Side View  
TFDT4500  
Top View  
This product is currently in devleopment. Inquiries regarding the status of this product should be directed to TEMIC Marketing.  
Pending—Rev. A, 03-Apr-98  
1
Pre-Release Information  
1234567...12

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