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TFDS6501E-TR4 PDF预览

TFDS6501E-TR4

更新时间: 2024-09-17 22:19:51
品牌 Logo 应用领域
威世 - VISHAY 驱动程序和接口接口集成电路
页数 文件大小 规格书
17页 666K
描述
Fast Infrared Transceiver Module Family (FIR, 4 Mbit/s) for 2.6 V to 5.5 V Operation

TFDS6501E-TR4 技术参数

是否无铅: 不含铅生命周期:Obsolete
零件包装代码:MODULE包装说明:,
针数:8Reach Compliance Code:unknown
风险等级:5.84Is Samacsys:N
接口集成电路类型:INTERFACE CIRCUITJESD-30 代码:R-XXMA-X8
功能数量:1端子数量:8
最高工作温度:85 °C最低工作温度:-25 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY认证状态:Not Qualified
最大供电电压:5.5 V最小供电电压:2.6 V
标称供电电压:3 V表面贴装:NO
温度等级:OTHER端子形式:UNSPECIFIED
端子位置:UNSPECIFIEDBase Number Matches:1

TFDS6501E-TR4 数据手册

 浏览型号TFDS6501E-TR4的Datasheet PDF文件第2页浏览型号TFDS6501E-TR4的Datasheet PDF文件第3页浏览型号TFDS6501E-TR4的Datasheet PDF文件第4页浏览型号TFDS6501E-TR4的Datasheet PDF文件第5页浏览型号TFDS6501E-TR4的Datasheet PDF文件第6页浏览型号TFDS6501E-TR4的Datasheet PDF文件第7页 
TFDU6101E/TFDS6401/TFDS6501E/TFDT6501E  
Vishay Semiconductors  
Fast Infrared Transceiver Module Family  
(FIR, 4 Mbit/s) for 2.6 V to 5.5 V Operation  
Description  
The  
TFDU6101E,  
TFDS6401,  
TFDS6501E, smallest FIR transceiver available on the market. This  
TFDT6501E are a family of low–power infrared wide selection provides flexibility for a variety of  
transceiver modulescomplianttotheIrDAstandardfor applications and space constraints. The transceivers  
fast infrared data communication, supporting IrDA are capable of directly interfacing with a wide variety  
speeds up to 4.0 Mbit/s (FIR), HP-SIR, Sharp ASK of I/O devices which perform the modulation/  
and carrier based remote control modes up to 2 MHz. demodulation  
function,  
including  
National  
Integrated within the transceiver modules are a photo Semiconductor’s PC87338, PC87108 and PC87109,  
PIN diode, an infrared emitter (IRED), and a SMC’s FDC37C669, FDC37N769 and CAM35C44,  
low–power CMOS control IC to provide a total and Hitachi’s SH3. At a minimum, a current–limiting  
front–end solution in a single package.  
resistor in series with the infrared emitter and a  
bypass capacitor are the only external  
components required implementing a complete  
solution.  
V
CC  
Vishay Telefunken’s FIR transceivers are available in  
four package options, including our Baby Face  
package (TFDU610xE), the standard setting, once  
FD eCaotmuprleiasnt to the IrDA physical layer standard  
D High Efficiency Emitter  
D Baby Face (Universal) Package Capable of  
Surface Mount Soldering to Side and Top View  
Orientation  
(Up to 4 Mbit/s),  
HP–SIR , Sharp ASK and TV Remote Control  
D For 3.0 V and 5.0 V Applications  
D Operates from 2.6 V to 5.5 V within specification,  
D Directly Interfaces with Various Super I/O and  
operational down to 2.4 V  
Controller Devices  
D Low Power Consumption (3 mA Supply Current)  
D Power Shutdown Mode (1 mA Shutdown Current)  
D Four Surface Mount Package Options  
D Built–In EMI Protection – No External Shielding  
Necessary  
D Few External Components Required  
Universal (9.7 × 4.7 × 4.0 mm)  
Side View (13.0 × 5.95 × 5.3 mm)  
Top View (13.0 × 7.6 × 5.95 mm)  
Dracula (11.2 × 5.6 × 2.2 mm)  
D Backward Pin to Pin Compatible to all Vishay  
Telefunken SIR and FIR Infrared Transceivers  
D Split power supply, transmitter and receiver can be  
operated from two power supplies with relaxed  
requirements, thus saving costs  
D Push-Pull-Receiver Output, grounded in  
shutdown mode  
AD pNpotleicboaotkioConmsputers, Desktop PCs,  
D Telecommunication Products  
Palmtop Computers (Win CE, Palm PC), PDAs  
(Cellular Phones, Pagers)  
D Internet TV Boxes, Video Conferencing Systems  
D External Infrared Adapters (Dongles)  
D Digital Still and Video Cameras  
D Printers, Fax Machines, Photocopiers,  
Screen Projectors  
D Medical and Industrial Data Collection Devices  
www.vishay.com  
1 (17)  
DocumentNumber82525  
Rev. B1.6, 02–Nov–00  

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