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TBSL30G PDF预览

TBSL30G

更新时间: 2024-12-01 00:59:43
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
3页 441K
描述
3.0 Amp Single Phase Glass Passivated Bridge Rectifier 50 to 1000 Volts

TBSL30G 数据手册

 浏览型号TBSL30G的Datasheet PDF文件第2页浏览型号TBSL30G的Datasheet PDF文件第3页 
M C C  
TBSL30A  
THRU  
R
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
Micro Commercial Components  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TBSL30M  
Features  
3.0 Amp Single Phase  
Glass Passivated  
Bridge Rectifier  
Glass passivated chip  
·
High surge forward current capability  
Halogen free available upon request by adding suffix "-HF"  
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
50 to 1000 Volts  
Compliant. See ordering information)  
Mechanical Data  
TBSL  
Operating Temperature: -55°C to +150°C  
Storage Temperature: -55°C to +150°C  
A
D
C
MCC  
Part  
Number  
Maximum  
Recurrent  
Marking Peak Reverse  
Voltage  
Maximum  
RMS  
Voltage  
Maximum  
DC  
Blocking  
Voltage  
50V  
100V  
200V  
Device  
B
J
TBSL30A  
TBSL30B  
TBSL30D  
TBSL30G  
TBSL30J  
TBSL30K  
TBSL30M  
50V  
100V  
200V  
400V  
600V  
800V  
1000V  
35V  
70V  
140V  
280V  
420V  
TBSL30A  
TBSL30B  
TBSL30D  
TBSL30G  
TBSL30J  
TBSL30K  
TBSL30M  
E
400V  
600V  
H
560V  
700V  
800V  
1000V  
G
F
Electrical Characteristics @ 25OC Unless Otherwise Specified  
Average Forward  
Current  
IF(AV)  
Tc=110  
3.0 A  
95A  
Peak Forward Surge  
Current  
Maximum  
Instantaneous  
Forward Voltage  
Maximum DC  
Reverse Current At  
Rated DC Blocking  
Voltage  
IFSM  
8.3ms, half sine  
TA = 25OC  
TA = 25OC  
IFM = 1.5A;  
IFM = 3.0A;  
1.0V  
1.1V  
I
VF  
ꢀꢁꢂꢃꢄꢅꢁꢆꢄꢅ  
ꢇꢃꢅ  
ꢋ ꢋ ꢋ ꢋ ꢁꢄꢌ  
ꢂꢂ  
OC  
ꢀꢁꢂ  
ꢂꢁꢄ  
.327  
.399  
ꢂꢈꢉ  
.342  
.415  
.228  
.074  
.005  
.244  
.039  
ꢂꢁꢄ  
ꢂꢈꢉ  
8.70  
ꢄꢆꢊꢃ  
IR  
5μA  
Tj = 25  
8.30  
OC  
1
Tj = 125  
10.55  
5.80  
1.90  
B
C
D
E
F
10.15  
5.60  
1.70  
0.02  
5.80  
0.20  
00μA  
.220  
.067  
.001  
.228  
.008  
Typical Thermal  
Resistance  
R
RthJL  
32 °C/W  
15 °C/W  
9 °C/W  
thJA  
0.12  
6.20  
G
H
1.00  
2.10  
2.40  
9.40  
RthJC  
.075  
.087  
.083  
.094  
1.90  
2.20  
I
J
Rating For Fusing  
I2t  
37.5A2s t<8.30ms  
.354  
9.00  
.370  
Mounting Pad Layout  
Dimensions in inches and (millimeters)  
Notes: 1.High Temperature Solder Exemption Applied, see EU Directive Annex Notes 7  
.213(5.40  
)
.098(2.50)  
.248(6.30)  
.425(10.80)  
.071(1.80)  
.063(1.60)  
.224(5.70  
)
www.mccsemi.com  
1 of 3  
2017/10/30  
Revision:B  

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