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SZMM3Z5V6T1G PDF预览

SZMM3Z5V6T1G

更新时间: 2024-11-07 00:47:39
品牌 Logo 应用领域
安森美 - ONSEMI 测试光电二极管
页数 文件大小 规格书
6页 119K
描述
Zener Voltage Regulators

SZMM3Z5V6T1G 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:R-PDSO-G2针数:2
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.50Factory Lead Time:8 weeks
风险等级:1.6Samacsys Description:Zener Voltage Regulators
配置:SINGLE二极管元件材料:SILICON
二极管类型:ZENER DIODE最大动态阻抗:40 Ω
最大正向电压 (VF):0.9 VJESD-30 代码:R-PDSO-G2
JESD-609代码:e3膝阻抗最大值:200 Ω
湿度敏感等级:1元件数量:1
端子数量:2最高工作温度:150 °C
最低工作温度:-65 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性:UNIDIRECTIONAL
最大功率耗散:0.3 W参考标准:AEC-Q101
标称参考电压:5.6 V最大反向电流:1 µA
反向测试电压:2 V子类别:Voltage Reference Diodes
表面贴装:YES技术:ZENER
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
最大电压容差:7.14%工作测试电流:5 mA

SZMM3Z5V6T1G 数据手册

 浏览型号SZMM3Z5V6T1G的Datasheet PDF文件第2页浏览型号SZMM3Z5V6T1G的Datasheet PDF文件第3页浏览型号SZMM3Z5V6T1G的Datasheet PDF文件第4页浏览型号SZMM3Z5V6T1G的Datasheet PDF文件第5页浏览型号SZMM3Z5V6T1G的Datasheet PDF文件第6页 
MM3ZxxxT1G Series,  
SZMM3ZxxxT1G Series  
Zener Voltage Regulators  
300 mW SOD323 Surface Mount  
This series of Zener diodes is packaged in a SOD323 surface  
mount package that has a power dissipation of 300 mW. They are  
designed to provide voltage regulation protection and are especially  
attractive in situations where space is at a premium. They are well  
suited for applications such as cellular phones, hand held portables,  
and high density PC boards.  
http://onsemi.com  
SOD323  
CASE 477  
STYLE 1  
Specification Features:  
Standard Zener Breakdown Voltage Range 2.4 V to 75 V  
Steady State Power Rating of 300 mW  
Small Body Outline Dimensions:  
1
2
0.067” x 0.049” (1.7 mm x 1.25 mm)  
Cathode  
Anode  
Low Body Height: 0.035” (0.9 mm)  
Package Weight: 4.507 mg/Unit  
ESD Rating of Class 3 (> 16 kV) per Human Body Model  
MARKING DIAGRAM  
AECQ101 Qualified and PPAP Capable SZMM3ZxxxT1G  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements  
These are PbFree Devices*  
xx  
G
G
Mechanical Characteristics:  
xx = Specific Device Code  
M = Date Code*  
CASE: Void-free, Transfer-Molded Plastic  
FINISH: All External Surfaces are Corrosion Resistant  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
LEADS: Plated with PbSn or Sn Only (PbFree)  
POLARITY: Cathode Indicated by Polarity Band  
FLAMMABILITY RATING: UL 94 V0  
G
= PbFree Package  
(Note: Microdot may be in either location)  
*Date Code orientation may vary depending  
upon manufacturing location.  
ORDERING INFORMATION  
MOUNTING POSITION: Any  
Device  
Package  
Shipping†  
MM3ZxxxT1G  
SOD323  
(PbFree)  
3,000 /  
Tape & Reel  
MAXIMUM RATINGS  
Rating  
Symbol  
Max  
Unit  
SZMM3ZxxxT1G SOD323  
(PbFree)  
3,000 /  
Tape & Reel  
Total Device Dissipation FR4 Board,  
P
D
(Note 1) @ T = 25°C  
300  
2.4  
mW  
A
Derate above 25°C  
mW/°C  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Thermal Resistance, JunctiontoAmbient  
R
416  
°C/W  
°C  
q
JA  
Junction and Storage Temperature Range T , T  
65 to +150  
J
stg  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 2 of  
this data sheet.  
2
1. FR4 printed circuit board, singlesided copper, mounting pad 1 cm .  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
January, 2014 Rev. 10  
MM3Z2V4T1/D  
 

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