MM5ZxxxST1G Series,
SZMM5ZxxxST1G Series
Zener Voltage Regulators
500 mW SOD−523 Surface Mount
This series of Zener diodes is packaged in a SOD−523 surface
mount package. They are designed to provide voltage regulation
protection and are especially attractive in situations where space is at a
premium. They are well suited for applications such as cellular
phones, hand held portables, and high density PC boards.
http://onsemi.com
SOD−523
CASE 502
STYLE 1
Specification Features
• Standard Zener Breakdown Voltage Range −2.4 V to 18 V
• Steady State Power Rating of 500 mW
• Small Body Outline Dimensions:
0.047″ x 0.032″ (1.20 mm x 0.80 mm)
1
2
• Low Body Height: 0.028″ (0.7 mm)
Cathode
Anode
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
• Tight Tolerance V
Z
MARKING DIAGRAM
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant*
XX MG
G
2
1
XX = Specific Device Code
Mechanical Characteristics
M
Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94, V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
*Date Code orientation may vary depending
upon manufacturing location.
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
ORDERING INFORMATION
†
MAXIMUM RATINGS
Device
Package
Shipping
Rating
Symbol
Max
Unit
MM5ZxxxST1G
SOD−523
(Pb−Free)
3,000 /
Tape & Reel
Total Device Dissipation FR−4 Board,
P
D
(Note 1) @ T = 25°C
500
4.0
mW
mW/°C
A
SZMM5ZxxxST1G SOD−523
(Pb−Free)
3,000 /
Tape & Reel
Derate above 25°C
Thermal Resistance from
Junction−to−Ambient (Note 1)
R
250
°C/W
SZMM5ZxxxST5G
SOD−523
(Pb−Free)
8,000 /
Tape & Reel
q
JA
Junction and Storage Temperature Range
T , T
−65 to
°C
J
stg
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
+150
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
2
1. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm .
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 2 of
this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
January, 2014 − Rev. 11
MM5Z2V4ST1/D