SZMM5Z12VST5G

更新时间： 2024-11-10 11:01:39

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
4页	93K
描述
Tight Tolerance Zener Diode 12 V ±2% SOD-523

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中文翻译

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SZMM5Z12VST5G 数据手册

MM5ZxxxST1G Series,

SZMM5ZxxxST1G Series

Zener Voltage Regulators

300 mW SOD−523 Surface Mount

This series of Zener diodes is packaged in a SOD−523 surface

mount package. They are designed to provide voltage regulation

protection and are especially attractive in situations where space is at a

premium. They are well suited for applications such as cellular

phones, hand held portables, and high density PC boards.

http://onsemi.com

SOD−523

CASE 502

Specification Features

• Standard Zener Breakdown Voltage Range −2.4 V to 18 V

• Steady State Power Rating of 200 mW

• Small Body Outline Dimensions:

0.047″ x 0.032″ (1.20 mm x 0.80 mm)

Cathode

Anode

• Low Body Height: 0.028″ (0.7 mm)

• ESD Rating of Class 3 (> 16 kV) per Human Body Model

MARKING DIAGRAM

• Tight Tolerance V

• SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

XX MG

• These Devices are Pb−Free and are RoHS Compliant*

XX = Specific Device Code

Mechanical Characteristics

CASE: Void-free, transfer-molded, thermosetting plastic

Epoxy Meets UL 94, V−0

LEAD FINISH: 100% Matte Sn (Tin)

MOUNTING POSITION: Any

Date Code*

= Pb−Free Package

(Note: Microdot may be in either location)

*Date Code orientation may vary depending

upon manufacturing location.

QUALIFIED MAX REFLOW TEMPERATURE: 260°C

Device Meets MSL 1 Requirements

ORDERING INFORMATION

MAXIMUM RATINGS

†

Device

Package

Shipping

Rating

Symbol

Max

Unit

MM5ZxxxST1G

SOD−523**

3,000 /

Total Device Dissipation FR−5 Board,

Tape & Reel

(Note 1) @ T = 25°C

300

1.5

SZMM5ZxxxST1G SOD−523**

SZMM5ZxxxST5G SOD−523**

3,000 /

Tape & Reel

Derate above 25°C

mW/°C

Thermal Resistance from

Junction−to−Ambient

390

°C/W

8,000 /

Tape & Reel

Junction and Storage Temperature Range

T , T

−65 to

+150

°C

stg

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−4 Minimum Pad.

**This package is inherently Pb−Free.

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the Electrical Characteristics table on page 2 of

this data sheet.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Publication Order Number:

July, 2013 − Rev. 9

MM5Z2V4ST1/D

12 3 4

中文翻译

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