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SZMM3ZxxxT1G

更新时间： 2024-11-24 12:22:47
品牌 Logo 应用领域
安森美 - ONSEMI 稳压器
页数 文件大小 规格书
5页 151K
描述
Zener Voltage Regulators

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SZMM3ZxxxT1G 数据手册

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MM3ZxxxT1G Series,  
SZMM3ZxxxT1G Series  
Zener Voltage Regulators  
200 mW SOD−323 Surface Mount  
This series of Zener diodes is packaged in a SOD−323 surface  
mount package that has a power dissipation of 200 mW. They are  
designed to provide voltage regulation protection and are especially  
attractive in situations where space is at a premium. They are well  
suited for applications such as cellular phones, hand held portables,  
and high density PC boards.  
http://onsemi.com  
SOD−323  
CASE 477  
STYLE 1  
Specification Features:  
Standard Zener Breakdown Voltage Range − 2.4 V to 75 V  
Steady State Power Rating of 200 mW  
Small Body Outline Dimensions:  
0.067” x 0.049” (1.7 mm x 1.25 mm)  
Low Body Height: 0.035” (0.9 mm)  
1
2
Cathode  
Anode  
Package Weight: 4.507 mg/Unit  
ESD Rating of Class 3 (> 16 kV) per Human Body Model  
AEC−Q101 Qualified and PPAP Capable − SZMM3ZxxxT1G  
MARKING DIAGRAM  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements  
These are Pb−Free Devices*  
xx  
G
G
Mechanical Characteristics:  
xx = Specific Device Code  
M = Date Code*  
CASE: Void-free, Transfer-Molded Plastic  
FINISH: All External Surfaces are Corrosion Resistant  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260C for 10 Seconds  
LEADS: Plated with Pb−Sn or Sn Only (Pb−Free)  
POLARITY: Cathode Indicated by Polarity Band  
FLAMMABILITY RATING: UL 94 V−0  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
*Date Code orientation may vary depending  
upon manufacturing location.  
ORDERING INFORMATION  
MOUNTING POSITION: Any  
Device  
Package  
Shipping†  
MM3ZxxxT1G  
SOD−323  
(Pb−Free)  
3,000 /  
Tape & Reel  
MAXIMUM RATINGS  
Rating  
Symbol  
Max  
Unit  
SZMM3ZxxxT1G SOD−323  
(Pb−Free)  
3,000 /  
Tape & Reel  
Total Device Dissipation FR−5 Board,  
P
D
(Note 1) @ T = 25C  
200  
1.5  
mW  
A
Derate above 25C  
mW/C  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Thermal Resistance, Junction−to−Ambient  
R
635  
C/W  
C  
q
JA  
Junction and Storage Temperature Range T , T  
−65 to +150  
J
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR−4 Minimum Pad  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 2 of  
this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
January, 2012 − Rev. 9  
MM3Z2V4T1/D  
 
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